MECHANIC Green UV Solder Mask Ink BGA PCB Paint Prevent Corrosive for iPhone Soldering Paste Flux UV Light Cured Welding Oil

BGA Chips is MOISTURE SENSITIVE DEVICES.

Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours

Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips: 245℃-260℃(Maximun)

Leaded/Pb BGA chips:180℃-205℃(Maximun)