Low cost multilayer circuito pcb
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- Supplier: Shenzhen Anlida Electronics Technology Co. Ltd.
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Product Overview
Description
Product Description
Low cost multilayer circuito pcb
Company Introduction:
All Services:
- High-Speed PCB Design / PCB Layout
- High-Speed PCB SI / PI / EMC Analysis
- Fast 1-24L PCB Prototype,samll-medium volume Fabrication
- Professional HDI PCB Production
- Rigid-Flex Board Manufacture
- SMT Assembly / PCBA Assembly
- PCB Parts Sourcing
PCB-parameters:
Printed Circuit Board Production:
| NO. | Item | Prototype | Mass Production |
| 1 | Layer Count | 1-30 Layers | 1-20 Layers |
| 2 | Max Panel Size | ≤1000X1000mm | ≤700X700mm |
| 3 | Base Material Type | FR4,High Tg FR4, Rogers,Halogen Free | FR4,High Tg FR4, Rogers,Halogen Free |
| 4 | Max Board Thickness | ≤10 mm | ≤10 mm |
| 5 | Min Board Thickness | 2L≥0.2mm,4L≥ 0.3mm 6L≥0.4mm,8L≥0.6mm 10L≥0.65mm,12L≥0.8mm | 2L≥0.2mm,4L≥ 0.3mm 6L≥0.4mm,8L≥0.6mm 10L≥0.65mm,12L≥0.8mm |
| 6 | Min Line Width | ≥ 0.05mm(2mil) | ≥ 0.064mm(2.5mil) |
| 7 | Min Line Space | ≥ 0.064mm(2.5mil) | ≥0.075mm(3mil) |
| 8 | Min Through hole | 0.15mm(6mil) | 0.15mm(6mil) |
| 9 | Min Blind hole | 0.1mm(4mil) | 0.1mm(4mil) |
| 10 | Min Buried Hole | 0.2mm(8mil) | 0.2mm(8mil) |
| 11 | Min Plated Hole Thickness | 20µm(0.8mil) | 20µm(0.8mil) |
| 12 | Surface coating | HASL,ENIG, OSP,ENIG+OSP,Plating Ni/Au/Ag | HASL,ENIG, OSP,ENIG+OSP,Plating Ni/Au/Ag |
| 13 | Solder Mask color | Green,Blue,Black,White,Yellow,Red | Green,Blue,Black,White,Yellow,Red |
| 14 | Silkscreen color | White,Black,Yellow,Red, | White,Black,Yellow,Red, |
| 15 | Thick Copper | 6oz/210µm | 4oz/140µm |
| 16 | MIN S/M Pitch | 0.1mm(4mil) | 0.1mm(4mil) |
| 17 | PTH Dia Tolerance | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
| 18 | NPTH Dia Tolerance | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| 19 | Hole Position Deviation | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| 20 | Outline Tolerance | ±0.15mm (±6mil) | ±0.15mm (±6mil) |
| 21 | Controlled Impedance | +/-5% | +/-10% |
| 22 | WARP and TWIST | ≤0.75% | ≤0.75% |
| 23 | Flammability Class | 94V-0 | 94V-0 |
| 24 | Solderability test | 255℃+/-5℃ | 255℃+/-5℃ |
| 25 | Thermal stress | 288+5℃,10Sec | 288+5℃,10Sec |
| 26 | Test Voltage | 50-330V | 50-330V |
| 27 | Adhesion Test | NO PEELING | NO PEELING |
| 28 | Other Inspection item | IPC-6012 / A-600H | IPC-6012 / A-600H |
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