Meilinmchip Original IC Chip Electronic Components Integrated Circuits Xilinx IC FPGA 360 I/O 665FCBGA XC5VFX30T 1FFG665C
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- Supplier: Zhejiang Meilinmchip Electronic Technology Co. Ltd.
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Description
Products Description
TYPE | DESCRIPTION | |
Mfr | Xilinx Inc. | |
Series | Kintex® UltraScale™ | |
Part Status | Active | |
Number of LABs/CLBs | 82920 | |
Number of Logic Elements/Cells | 1451100 | |
Total RAM Bits | 77721600 | |
Number of I/O | 624 | |
Voltage - Supply | 0.922V ~ 0.979V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1517-BBGA, FCBGA | |
Supplier Device Package | 1517-FCBGA (40x40) | |
Base Product Number | XCKU115 |
Xilinx develops a variety of highly flexible adaptive processing platforms that support rapid innovation across technologies, from
endpoints to edges to the cloud. As a semiconductor company, Xilinx focuses on programmable logic devices, inventing field
programmable gate array (FPGA), hardware programmable on-chip System (SoC), and adaptive Computing Acceleration Platform (ACAP).
Composition of FPGA chip 1) Programmable input/output unit; 2) Basic programmable logical unit; 3) Complete clock management; 4)
Embedded block-type RAM; 5) Abundant wiring resources; 6) Embedded underlying functional units and dedicated hardware modules.
endpoints to edges to the cloud. As a semiconductor company, Xilinx focuses on programmable logic devices, inventing field
programmable gate array (FPGA), hardware programmable on-chip System (SoC), and adaptive Computing Acceleration Platform (ACAP).
Composition of FPGA chip 1) Programmable input/output unit; 2) Basic programmable logical unit; 3) Complete clock management; 4)
Embedded block-type RAM; 5) Abundant wiring resources; 6) Embedded underlying functional units and dedicated hardware modules.
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