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ITEM | CAPABILITY | |||
1.Base Material | FR-4 / High TG FR-4 /Aluminum /CEM1/Rogers/Arlon/Taconic/Teflon | |||
2.Layers | 1-40 L | |||
3.Finised inner/outer copper thickness | 1-6OZ | |||
4.Finished board thickness | 0.1-6.0mm | |||
5.Min hole size | Mechanical hole: 0.12mm Laser hole: 0.1mm | |||
6.Controlled Impedance | +/-5% | |||
7.Plugging vias capability | 0.2-0.8mm | |||
8.Outline profile | Rout/ V-cut/ Bridge/ Stamp hole | |||
9.Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP… |