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Item(PCB) | Process Capability |
Number of layers | 1-30 |
Plate Material type | FR4、HighTG FR-4,Aluminum plate、Rogers 4350B、Rogers4003C、Copper substrate 2.0、Rigid-flex board、FPC Plate |
Rigid board | Backplane, HDI, multilayer buried blind vias, thick copper board, thick copper power supply, semiconductor test board |
Maximum finished inner/outer copper thickness | Outer layer 8OZ (greater than 8OZ needs to be reviewed), inner layer 6OZ (greater than 6OZ needs to be reviewed) |
Finished board thickness | 0.1-5.0mm(Less than 0.2mm, greater than 6.5mm need to be reviewed,) |
Minimum aperture | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Surface treatment | Electroplated copper nickel gold, immersion gold, hard gold plating (with/without nickel), gold-plated fingers, lead tin spray, lead-free tin spray, OSP, electroless nickel palladium gold, soft gold plating (with/without nickel), immersion silver , Immersion Tin, ENIG+OSP, ENIG+G/F, Full Board Gold Plated+G/F, Immersion Silver+G/F, Immersion Tin+G/F |
The smallest BGA pad diameter | Lead spray tin process 10mil, lead-free tin spray process 12mil, other processes 7mil |
Minimum line width and line spacing | 3mil |
Solder mask ink color | Green, yellow, black, blue, red, white, purple, matte green, matt oil black, high refractive white oil |
Character ink color | White, yellow, black |
Item(SMT) | Process Capability |
Largest card board | L50×W50mm~L510×W460mm |
Maximum thickness | 3mm |
Minimum thickness | 0.2mm |
Smallest chip part | 150mm*150mm,01005 Encapsulation or above |
Maximum part size | Maximum part placement accuracy (100FP) |
Minimum lead part spacing | 0.3mm |
Minimum distance between spherical parts (bga) | 0.3mm |
Maximum part placement accuracy(100FP) | The placement accuracy of the whole process is up to ±50 microns, and the repeatability of the whole process is up to ±30 microns |
Mounting ability | 3-4 million points/day, 50-150 models |
DIP Plug-in processing | 100,000 points |
Character ink color | White, yellow, black |




PCB&PCB'A
Printed Circuit Board &
Printed Circuit Board+Assembly )
SMT
Surface Mounted Technology

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