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Spherical silica micropowder is a kind of spherical silica powder material with small specific surface area, good fluidity and low stress obtained by processing selected irregular angular silica micropowder as raw material into spherical shape by flame melting method.
Spherical silica micropowder is white powder with relatively high purity, very fine particles, good dielectric properties and thermal conductivity, low expansion coefficient, high heat resistance, high moisture resistance, high filling amount, low expansion, low stress, Low impurities, low friction coefficient and other advantages.
(1) The surface of the ball has good fluidity and is evenly stirred with the resin to form a film, so that the amount of resin added is small, and the filling amount of silicon micropowder is the highest. The higher it is, the smaller the thermal expansion coefficient and the lower the thermal conductivity, the closer it is to the thermal expansion coefficient of single crystal silicon, and the better the performance of the electronic components produced.
(2) The spherical plastic sealant has the smallest stress concentration and the highest strength. The microelectronic device thus produced has a high yield, is convenient for transportation and installation, and is not prone to mechanical damage during use.
(3) The friction coefficient of spherical powder is small, and the wear on the mold is small, so that the service life of the mold can be doubled.
Application field:
1. Electronics and electrical appliances industry
2. Honeycomb Ceramics
3. Paints & Coatings
4. Adhesive
5. Cutting-edge application fields

Item | Unit | Standard | Result |
D50 | um | 8.5-11.5 | 9.93 |
D100 | um | ≤35.0 | 27.4 |
Moisture Content | % | ≤0.15 | 0.04 |
LOI | % | ≤0.5 | 0.09 |
SiO2 | % | ≥99.7 | 99.80 |
Fe2O3 | % | ≤0.03 | 0.007 |
Al2O3 | % | ≤0.4 | 0.104 |
Electrical Conductivity | us/cm | ≤4.0 | 0.5 |
Magnetic Content | ppm | ≤7.0 | 1.7 |











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