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PCB Item | Manufacture Capacity | ||||||||
Layer Counts | 1--40L | ||||||||
Base Material: | FR4,High-TG FR4,Halogen free,aluminum,High Frequency(Taconic,Aron,PTFE,F4B) | ||||||||
Max board size(mm) | 1200x400mm | ||||||||
Board Thickness | 0.4mm--7mm | ||||||||
Minimum line/space | 0.075mm | ||||||||
Min Hole Size(mechanical) | 0.15mm | ||||||||
Min Hole Size(laser hole) | 0.1mm | ||||||||
Copper Weight | 0.5--6oz | ||||||||
Surface Finish | HAL,lead-free HAL,ENIG,Plated Gold,Immersion Gold,OSP | ||||||||
Solder Mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue | ||||||||
Silkscreen | White, Black, Blue,Yellow | ||||||||
Acceptable File Format | Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 | ||||||||
Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
FPC Item | TECHNICAL PARAMETER | ||||||||
Layers | 1-6 Layers | ||||||||
Mini thickness | 0.08mm | ||||||||
Min.Line Width | 0.05mm | ||||||||
Min.Hole Size | 0.15mm PTH | ||||||||
Min. PTH Hole Ring | 0.45mm | ||||||||
Min. Gap between Cover Layer and Pad | 0.1mm | ||||||||
Min. Gap between Trace and Outline | 0.2mm | ||||||||
Trace Width Tolerance | ±0.03mm W±30% | ||||||||
Outline Tolerance | ±0.05mm L≤25mm | ||||||||
Hole Size Tolerance | ±0.05mm | ||||||||
Stiffener and Outline Tolerance | ±0.1mm | ||||||||
Surface Treatment | ENIG,Gold Plating,HAL,Plating Pb-Sn |
PCBA Item | TECHNICAL PARAMETER | ||||||||
Stencil size/range: | 736x736mm | ||||||||
Minimum IC pitch: | 0.30mm | ||||||||
Maximum PCB size: | 1200x 500mm | ||||||||
Minimum PCB thickness: | 0.35mm | ||||||||
Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) | ||||||||
Maximum BGA size: | 74x74mm | ||||||||
BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) | ||||||||
BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) | ||||||||
QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) | ||||||||
Frequency of stencil cleaning: | 1 time/5 to 10 pieces |
Delivery Time | ||||||||||
Sample Lead Time | Mass Production Lead time | |||||||||
Single Sided PCB | 1-2 Days | 4-7 Days | ||||||||
Double Sided PCB | 2-4 Days | 7-10 Days | ||||||||
Multilayer PCB | 5-8 Days | 10-15 Days | ||||||||
PCB and Assembly | 8--15 Days | 15--20 Days |