high quality IC reballing stencil for repair smart phone chip

 Feature :

• 100% Brand new, high quality & durable 


• Good after sale service provide.

Notice pls :

• When using, place the stencil aperture aligned with the corresponding chip pad, apply a solder paste, and wipe evenly with a hot air gun after blowing a little far point (about 300 degrees), heat evenly.


• Well after planting tin, one with a sharp forceps poke holes so that the stencil with a little chip separation, must not be the first time they vigorously tear, which would dismantle the bad steel mesh, or the chip seal legs ripped!

      Contains all for iphone 6g/6p models all need to tin the IC and CPU model 

Quality Control:

1.High quality and 100% all tested before shipping

2.We have a professional QC team,Each products are through strict test with inspection machine and inspection before shipment,Ensure the goods can be used to your country

3.Products will be check again before shipment

4.Free technical support always.

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Payment:

1.We accept

T/T(Bank Transfer, Wire Transfer), Western Union , MoneyGram and PayPal .

2.we all products  immediately shipping after full payment, fast delivery  .

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Packing: All the goods you ordered will be sent by international shipping way.

Must be packaged safely(One anti-static bag, one little bubble bage, one foam box, one big carton box).

Shipping: We will try our best to choose the faster and cheapest, but the safe shipping is impartant too. Can send by DHL/ TNT/Fedex/UPS/EMS

Delivery time: Usually 3-5 working days if no accident.