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Supported Capabilities | |
Types of Assembly | SMT (Surface-Mount Technology) |
THD (Thru-Hole Device) | |
SMT & THD mixed | |
Double sided SMT and THD assembly | |
SMT Capability | PCB layer: 1-32 layers; |
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; | |
Board type: Rigid FR-4, Rigid-Flex boards | |
PCB thickness: 0.2mm-7.0mm; | |
PCB dimension width: 40-500mm; | |
Copper thickness: Min:0.5oz; Max: 4.0oz; | |
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; | |
Component size: 0.6*0.3mm-33.5*33.5mm; | |
Component height: 6mm(max); | |
Pin spacing laser recognition over 0.65mm; | |
High resolution VCS 0.25mm; | |
BGA spherical distance: ≥0.25mm; | |
BGA Globe distance: ≥0.25mm; | |
BGA ball diameter: ≥0.1mm; | |
IC foot distance: ≥0.2mm; |