Rigid Flex PCB with soft board on the surface Rigid Flex PCB for cars Rigid Flex PCB customization

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Price:$16.00 - $20.00

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Product Overview

Description



Specification


item
value
Model Number
TWS-RF02
Type
Rigid-Flex pcb
Place of Origin
China
Guangdong
Brand Name
TWS
Base Material
PI+High TG FR4
Copper Thickness
Inner layer:0.5OZ, Outer layer:1 OZ
Board Thickness
0.3mm
Min. Hole Size
0.1-6.5mm
Min. Line Width
3mil
Min. Line Spacing
3mil
Surface Finishing
ENIG,HASL,OSP,ENEPIG,Flash Gold
Board Size
OEM
Product name
Automotive Rigid Flex PCB
Layer
4
Material
PI+High TG FR4




Rigid and flexible board process capability parameter table
Project Name
Processing capacity

Product Structure
Rigid-flexible combination structure

F+N, N+F+N,, 1+F+1 (HDI)



Material Type
Flexibles
PI, PET, LCP
Rigid Materials
High tgFR4, PTFE, ceramic filled
Reinforcing materials
FR-4, PI, steel flakes
Dynamic zone protection layer
Overlay film, nuisance ink

Product color
Rigid area
Green, yellow, black, blue, red, white, green matte, black matte, orange
Flexible area
Yellow, black, white, blue, red

Plate thickness
Rigid area
0.3mm-6.5mm (including soft board)
Flexible area
0.1-0.4mm
Dimensional Tolerance
Rigid area
n+/-0.1mm
Flexible area
n+/-0.03mm


Large copper thick
Inner copper thickness
3 OZ
Outer copper thickness
6 OZ
Distance from the hole to the edge of the ladder
Hole edge to step edge

0.5mm
Large aspect ratio
Rigid area
16:1


Applications : Cars
Number of layers:4 Layers
Plate thickness:0.3MM
Copper thickness:Inner layer:0.5OZ, Outer layer:1 OZ
Material Science:PI+High TG FR4

Technical difficulties:
1、Soft plate on the surface
2、surface treatment nickel palladium gold
3、Minimum bga 0.12MM
4、Semi-porous structure



Applications : The Medical
Number of layers:6 Layers
Plate thickness:1.6mm
Copper thickness:"0.5 OZ inner,1 OZ outer"
Material Science:PI+High TG FR4

Technical difficulties:
1、More dynamic connection bits
2、Impedance control in soft board area
3、 Rigid board "island" structure


Applications :Connector
Number of layers:8 Layers
Plate thickness:1.6MM
Copper thickness:0.5OZ, Outer layer:1 OZ
Material Science:PI+High TG FR4

1、Minimum line width line spacing 0.04/0.035MM
2、Blind hole plating filling
3、First-order HDI












0.4118 s.