MOR 1WSS EBG resistor In ballast circuit Metal oxide film resistor

     7.6 Moisture-proofLoad Life:

          The resistors arrayed are placed into a constant temp./humidity oven at the temp. of 40            ±2°c  and the humidity of 90~95%, then rated power is applied for 1.5 hours and cut off            for 0.5 hour. The similar cycle will be repeated for 500^+24 _-0 hours in total (including                  cut-off time). Then remove the voltage, taking the resistors out of the oven and leaving            them at room temp. for one hour. The resistance value change ratebetween pre-and-              post test shall be within ±5%. There also shall be no evidence of remarkablechange                on appearance, and the markingshall not be illegible.

      7.7 Solder-ability:

            The leads with flux are dipped in a melted solder of 235 ±5°c  for 2 seconds,more than              95% of the circumference of the lead wires shall be covered with solder.

      7.8 Resistance to Soldering Heat:

            Two leads are together dipped in a melted solder of 270 ±5°c for 10 ±1seconds, or 350              ±10°c  for 3.5 ±0.5 seconds, Then remove the resistorsand leaving them at room                        temp. for one hour. The resistance value change rate between pre-and-post test shall              be within ±1%.

       7.9 Nonflammability:

             The resistors are applied the power of 16 times the rated wattage for 5 min. and          

              shallnot get flame.

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