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Biwintech PD900 size and weight information | ||
Model :PD900 | millimeter/g/kg | inch / pound |
Product Dimension | 83×83×13mm(L×W×H)±0.20mm | 3.24"×3.24"×0.5" |
Product Weight | 40g | 0.09 lbs |
Packaged (Single Pc) Dimension | 150mm×105mm×32mm | 5.85"×4.1"×1.25" |
Packaged (Single Pc) Weight | 88g | 0.2 lbs |
Inner Carton Dimension | 345mm×218mm×170.5mm | 13.46"×8.5"×6.65" |
Inner Carton Weight | 2.35 Kg | 5.17 lbs |
Master Carton Dimension | 455mm×362mm×384mm | 17.75"×14.1"×15" |
Master Carton Weight | 10.6Kg | 23.32 lbs |
QTY Inner/QTY Master Carton | 20PCS/ Inner,80PCS/Master Carton | 20/80 pcs |
1.Local Support
1)17 + service centers around the world , covering 39 countries and regions.
2)Respond to local customer needs in a timely manner.
2.End-to-end R&D System
1) A complete project management system was established to form a closed loop covering all processes from demand to delivery in order to boost BIWIN'S overall competitiveness.
2) BIWIN continues to improve the R&D system featuring collaborative cooperation and technologysharing , creating a better platform and management model for core technology , and ensuring thatour designs are closely related to our experiences.
3.Productivity Assurance
1) BIWIN Huizhou is expected to pack 120,000pcs of 12-inch wafers per month .
2) Makes concerted efforts through investment and cooperation to ensure delivery on time.
4.Customer Satisfaction
1) BIWIN is a leading actor in entering the worlds TOP supply chains , gaining abundant experience in delivering both general and customized products.
2) BIWIN is one of the memory chips supplier that boasts greater credibility of mainstream SOC platforms.
5.Quality Management
1) BIWIN'S competitive edge in core technology , development , quality and productivity owes muchs operation model featuring.
2) MES 4.0 was introduced to achieve product life cycle management of each Die.
3) For special automation requirements,BIWIN applies the controlled BOM in the manufacturingprocess.
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