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Supported Capabilities | |||||||
Types of Assembly | SMT (Surface-Mount Technology) | ||||||
THD (Thru-Hole Device) | |||||||
SMT & THD mixed | |||||||
Double sided SMT and THD assembly | |||||||
SMT capability | PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; | ||||||
Board type: Rigid FR-4, Rigid-Flex boards | |||||||
PCB layer: 1-32 layers; | |||||||
PCB thickness: 0.2mm-7.0mm; | |||||||
Copper thickness: Min:0.5oz; Max: 4.0oz; | |||||||
Assembly process | Lead-Free (RoHS, REACH) | ||||||
Electrical testing | AOI (Automated Optical Inspection), | ||||||
X-ray Inspection | |||||||
ICT (In-Circuit Test)/ Functional testing | |||||||







Equipment List (PCBA) | ||||
Name | Brand&No | Quantity | ||
Wave-soldering | SUNSET | 1 | ||
Automatic solder paste printer | ZHENGSHI-ASE | 1 | ||
Automatic solder paste printer | GKG | 1 | ||
SMT Machine | SAMSUNG SM411 | 2 | ||
HANWNA SM481 PLUS | 1 | |||
Reflow Welding | JT TEA1000D | 1 | ||










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