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Item | RPCB | HDI |
minimum linewidth/linespacing | 3MIL/3MIL(0.075mm) | 2MIL/2MIL(0.05MM) |
minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) |
minimum solder resist opening (single-side) | 1.5MIL(0.0375MM) | 1.2MIL(0.03MM) |
minimum solder resist bridge | 3MIL(0.075MM) | 2.2MIL(0.055MM) |
maximum aspect Ratio (thickness/hole diameter) | 10:1 | 8:1 |
impedance control accuracy | +/-8% | +/-8% |
finished thickness | 0.3-3.2MM | 0.2-3.2MM |
maximum board size | 630MM*620MM | 620MM*544MM |
maximum finished copper thickness | 6OZ(210UM) | 2OZ(70UM) |
minimum board thickness | 6MIL(0.15MM) | 3MIL(0.076MM) |
maximum layer | 14 | 12 |
Surface treatment | HASL-LF、OSP 、Immersion Gold、 Immersion Tin 、Immersion Ag | Immersion Gold、OSP、selectiveimmersion gold、 carbon print |
Min/max laser hole size | 3MIL / 9.8MIL | |
laser hole size tolerance | 10% |
PCB manufacturing | ||||||
Layer | quick turn (hours) | usual time (days) | Mass productions>30m2 (days) | |||
2 | 24 | <4 | <10 | |||
4 | 48 | <6 | <12 | |||
6 | 78 | <8 | <14 | |||
8 | 96 | <10 | <16 | |||
10+ | 120+ | <12 | <18 | |||





Bare PCB prototype | PCBA (PCB Assembly) | |||||
Layer | Quick turn (hours) | Quantity | Quick turn (days) | |||
2 | 24 | <30pcs | 1 | |||
4 | 48 | <30-100pcs | 2 | |||
6-8+ | 72+ | 100-1000pcs | 5 | |||

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