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Item | specification |
Printed circuit boards | 1-20 layer rigid PCB boards; HASL, Carbon oil, ENIG, Hard gold plated, BGA, COB, HDI, Impedance, etc. |
Min. board thickness | 0.15mm, 0.2mm super thin FR4 PCBs |
Featured crafts | HASL, carbon oil, hard gold plated, BGA, COB, HDI, impedance, blind and buried vias, half holes, immersion tin plating, etc |
Fast PCB | 24/36H fast PCB prototype |
Flex-rigid pcb | 2-12 layer rigid flex pcb boards |
Other service | PCB design, PCB +BOM clone, PCB assembly(SMT, DIP...) |
NO | Item | Process capability |
1 | product type | FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB |
2 | Max layer count | 20 layers |
3 | Min base copper thickness | 1/3 OZ (12um) |
4 | Max finished copper thickness | 10 OZ (350um) |
5 | Min trace width/spacing(Inner layer) | 2/2mil (0.05mm) |
6 | Min trace width/spacing(Outer layer) | 2/2mil (0.05mm) |
7 | Min spacing between hole to inner layer conductor | 6mil (0.15mm) |
8 | Min spacing between hole to outer layer conductor | 6mil (0.15mm) |
9 | Min annular ring for via | 4mil (0.1mm) |
10 | Min annular ring for component hole | 4mil (0.1mm) |
11 | Min BGA diameter | 4mil (0.1mm) |
12 | Min BGA pitch | 4mil (0.1mm) |
13 | Min hole size | 0.15mm(CNC); 0.1mm(Laser) |
14 | Max aspect ratios | 8.01 |
15 | Min soldermask bridge width | 4mil (0.1mm) |
17 | Min thickness for insulating layer | 1mil (0.025mm) |
18 | HDI & special type PCB | HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc |
19 | Surface treatment type | ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin plating |
20 | Max PCB size | Multi-layer: 600*550mm 1-2 layer: 500*1200MM |