Flexible PCB Fpcb for LED Strip Factory
US $28.00-$30.00
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FPC PRODUCTION CAPABILITY | ||||
Item | Content | Regular Capability | Special | |
1 | Layer | 1-6L | Above 8L | |
2 | Max.Array Size | 500*600mm | 250*1500mm | |
3 | Min.board Size | 1-*1mm | ||
4 | Max.board thickness | 0.23mm | 0.4mm | |
5 | Min.board thickness | 0.075mm | 0.065mm | |
6 | (0.075mm≤T Tolerance±0.03mm | V | 575 | |
7 | (0.035mm≤T Tolerance±0.05mm | ℃ | 130 | |
8 | (0.6mm≤T Tolerance±0.1mm | %(50-260℃) | 0.5 | |
9 | Max Drill bit Diameter | 6.5mm | ||
10 | Min Drill bit Diameter | 0.20mm | 0.15mm | |
11 | Routing tolerance | ±0.2mm | ±0.15mm | |
12 | Min Base Copper | 1/3 OZ | 1/4 OZ | |
13 | Max Base Copper | 2 OZ | 4 OZ | |
14 | Min Coverlay Thickness | 1mil(PI0.5mil Adhesive 0.5mil) | ||
15 | Max Coverlay Thickness | 2mil(PI1mil Adhesive 1mil) | ||
16 | Tolerance of holes diameter(PTH) | ±0.05mm | ||
17 | Tolerance of holes diameter(NPTH) | ±0.025mm | ||
18 | Hole Position Deviation(hole to hole compared with the CAD data) | ±0.05mm | ||
19 | Hole Position Deviation(copper foil to hole compared with the CAD data) | ±0.07mm | ||
20 | PTH wall copper thickness | 12-18um | ||
21 | Minimum Trace Width/Space | 1/3OZ Cu 1L 50/60um 1/2OZ 2L 70/80um 1OZ Cu 1L 70/80um 1OZ Cu 2L 80/90um | ||
22 | Min distance copper foil to the edge | ±0.10mm | ±0.07mm | |
23 | Offset tolerance of silk character | ±0.3mm | ±0.2mm | |
24 | Soldermask printing offset tolerance | Photo sensitive:±0.1mm(±4mil) Printed backing:±0.3mm(±8mil) | ±0.075mm ±0.2mm | |
25 | Soldermask thickness | Photo sensitive:0.007-0.02mm(0.3-0.8mil) Printed backing:0.01-0.025mm(0.4-1mil) | ||
26 | Protective film alignment accuracy(joint offset tolerance) | ±0.15mm | ±0.10mm | |
27 | Min protective film lamination spilled glue amount | 0.5mil Adhesive≤0.1mm(4mil) 1mil Adhesive≤0.15mm(6mil) | ||
28 | Tin thickness(Max),(Min)/Tolerance | (0.2mil)-(2.0mil)±0.30mm | ||
29 | Gold plating, Ni thickness(Gold finger or other parts) | 1-6 u inch | Min 30 u inch Max 280 u inch | |
30 | Gold plating, Au thickness(Gold finger or other parts) | 1-6u inch | 1-10 u inch | |
31 | ENIG Ni/Au thickness(Gold finger or other parts) | Ni:30-150u inch Au:±1u inch | 4 u inch | |
32 | (OSP) | 0.2-0.8um | ||
33 | Die Punching Min hole/tolerance | Min:0.5mm/±0.05mm | +0.06/-0mm | |
34 | Alignment tolerance of manual joint operation | ±0.30mm | ±0.2 | |
35 | Alignment tolerance of fixture joint operation | ±0.15mm |
TEST QUALITY CONTROL | Aluminum Production Capability | |||
Item | Testing Content | Condition | ||
1 | Voltage of E-test | 250±25V | ||
2 | Short circuit impedance | ≥100Ω | ||
3 | Open-circuit impedance | ≥100Ω | ||
4 | Solderability testing | 245±5℃,5Sec | ||
5 | Heat stress testing | 288±5℃,10Sec | ||
6 | Thermal resistance | 94V-0 | ||
7 | Min tolerance for impedance control | ±10% |