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Layers | 4 layers |
Board Thickness | 1.6mm |
Material | Fr4 |
Copper Thickness | 35um |
Size | Customization |
Number of Layers | 1,2,4,6,up to 32layers |
PCB Standard | IPC-A-610 D/IPC-III Standard |
Surface Finish | HASL LEAD FREE |
Testing Service | AOI X-Ray Function Test |
Certificate | ISO9001/Iso14001/CE/ROHS |
Inner package | Vacuum packing |
Board Thickness Tolerance | ±0.1mm |
Min. Hole Size | 0.1mm |
Min. Line Width/Gap | 0.075mm |
Impedance | Customization |
MOQ | 1pc |

FR4 PCB Technical Capacity | ||||
Item | Capability | Details | ||
PCB layers | 1-32 layers PCB | |||
Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide | |||
Max size | 560x1100mm | normal size within 550x420mm | ||
Outline tolerance | ±0.05mm / ±0.1mm | CNC tolerance ±0.1mm,V-cut board outline tolerance±0.05mm | ||
PCB thickness | 0.4--3.2mm | 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0/3.2mm | ||
PCB thickness tolerance | ±0.1mm | |||
Surface Finish | HASL/HALS LeasFree/OSP/ENIG/Hard Gold/Golden finger | |||
Min trace width | 3mil(0.075mm) | |||
Min trace distance | 3mil(0.075mm) | |||
Finished outer layer copper thickness | 35um/70um/105um(1OZ/2OZ/3OZ) | the finished PCB's outer layer copper thickness,1 OZ=35um,2 OZ=70um, 3OZ=105um | ||
Finished inner layer copper thicknss | 35um/50um | For prototype, inner copper thickness is 50um | ||
Drill size ( machine drill) | 0.2--6.3mm | 0.2mm is the minmum drill size, 6.3mm is the maxmum drill size the machine can drill. | ||
Via annular ring | ≥0.153mm(6mil) | Minimum size of via annular ring can not be less than 0.153mm | ||
Finished TH size ( machine drill) | 0.2--6.20mm | Size of Finished hole is usually smaller than size in drill file because it has copper attahced. | ||
Hole tolerance (machine drill ) | ±0.08mm | Hole tolerance is ±0.08mm, for a designed 0.6mm hole,finished hole size will be between 0.52--0.68mm. | ||
Type of solder resist | Liquid photoimagable solder mask (LPSM) | |||
Minimum Silscreen character Width | ≥0.15mm | Other wise it will be not clear for visual | ||
Minimum Silscreen character Length | ≥0.8mm | Other wise it will be not clear for visual | ||
Character width to height ratio | 1:05 | Best width to height ratio for silkscreen printing. | ||
Distance from trace to outline | ≥0.3mm(12mil) | For routing,distance from trace to outline should ≥0.3mm;For V-cut this distance should be ≥0.4mm | ||

SMT MACHINE | ||||
ITEM | YAMAHA F8S | YAMAHA G5SD | ||
Machine Size | 1.2m*2.8m | 1.2m*2.8m | ||
Capacity | 12500CPH | 7500CPH | ||
Components Size | 0.3*0.15mm-44*44mm | 0.3*0.15mm-72*72mm | ||
Components Thickness | MAX.12.7mm | MAX.25.4mm | ||
Pin Spacing | ≥0.3mm | ≥0.3mm | ||
Min. Pin Width | 0.1mm | 0.1mm | ||
Min.Pin Length | 0.2mm | 0.2mm | ||
BGA Dia. | 0.13mm | 0.13mm | ||
BGA Spacing | 0.25mm | 0.25mm | ||
Type of Component | MAX.80 | MAX.80 | ||
PCBA Technical Capacity | ||
Quantity | Prototype & Batch | |
Type of Assembly | SMT,Thru-hole | |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free | |
Components | Passive Down to 01005 size | |
BGA and VFBGA | ||
Leadless Chip Carriers/CSP | ||
Double-sided SMT Assembly | ||
Fine Pitch to 0.8mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement | ||
File Formate | Bill of Materials | |
Gerber files | ||
Pick-N-Place file | ||
Types of Service | Turn-key,partial turn-key or consignment | |
Component package | Cut Tape,Tube,Reels,Loose Parts | |
Testing | Flying Probe Test,X-ray Inspection AOI Test | |
PCBA certification | UL Approval,ROHS,ISO9001:2000,TS16949 | |








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