FD 380XL high precision surface grinder for single surface grinding and polishing of optical glass wafers

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Product Overview

Description



Product Description


Main applications:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, various pieces, mold, light guide plate, light stick joint valve plate, hydraulic tight, stainless steel, and other materials single side grinding, polishing.


PRODUCT SPECIFICATIONS


Standard Specification
Machine Model
FD-3803X
FD-4603X
FD-6103X
FD-9103X
Plate Diameter
Φ380mm/15inches
Φ460mm/18inches
Φ610mm/24inches
Φ910mm/36inches
Max. Workpiece Diameter
(without conditioning ring)
Φ180 mm
Φ220 mm
Φ270 mm
Φ420mm
Conditioning Ring Diameter
Φ180 mm
Φ220 mm
Φ270 mm
Φ420mm
Number of Station
3
3
3
3
Plate Rotate Speed
0-140 rpm
0-140 rpm
0-120 rpm
0-90rpm
Facing & Grooving Speed
(Not include in Polishing)
0-120 mm/m
0-120 mm/m
0-120 mm/m
0-120 mm/m
Total Weight
450 kg
780 kg
1000 kg
1600 kg
Total Floor Space
670×940 mm
1030×730 mm
1920×840 mm
2100×1300 mm


Built-In Optional Kits
Grade
Standard
Upgraded
Advanced
Controls
Digital
Digital
Touch-Screen PLC
Pressure Source
Hand Weight Block
Pneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System
-
Manual
Digital, Manual
Cylinder Bar Drive System
-
Manual
Integrated with PLC
Conditioning Ring Drive System
-
Manual
Integrated with PLC
Machine Enclosure
-
Framed by Aluminum Alloy
Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.




SPECIFICATION


Features:
1. Frequency conversion control to achieve soft start, soft stop, low impact, high stability, high reliability.

2. The grinding machine adopts the pressure weight block self-weight pressure, the flatness of the workpiece after processing can reach ±0.0005mm, the surface roughness of the workpiece after polishing can reach Ra0.002, to ensure the stability of the high-precision surface processing, saving a lot of time.

3. The circulating filling system of grinding liquid can not only meet the requirements of environmental protection, but also make full use of grout, reduce the waste of grout and save the cost of consumables.

4. Imported bearings and motors are adopted to ensure the stability and life of the equipment and the precision requirements of the workpiece.


Main uses:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, molds, compressor valves, hydraulic seals, light guide plate, light post joint and other materials of single-side grinding, polishing.



Successful Cases


Valve Plate
304 stainless steel


Wafer Substrate
sillicon
Ceramics


Patent and Certification






FAQ


Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness,


dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.


Q2: Does Ponda charge for making samples
A: No, it's free to make samples.


Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.


0.1912 s.