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PCB Assembly Capability | ||
Item | Capability | |
Advantages | ----Intelligent Management System, Intelligent Factory | |
----Professional Surface-mounting and Through-hole soldering technology | ||
----Various sizes like 1206,0805,0603 components SMT technology | ||
----ICT(In Circuit Test),FCT(Functional Circuit Test) | ||
----PCB Assembly With IPC,CCC,FCC,Rohs Approval | ||
----High Standard SMT&Solder Assembly Line | ||
----High density interconnected board placement technology capacity. | ||
Components | BGA and VFBGA | |
Leadless Chip Carriers/CSP | ||
Double-sided SMT Assembly | ||
Passive Down to 0201 size | ||
Fine Pitch to 0.8mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement | ||
Types of Service | Turn-key,partial turn-key or consignment | |
Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 100, or up to 1000 and customized | |
Type of Assembly | SMT, Thru-hole | |
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free | |
File Formate | Gerber files, Pick-N-Place file, Bill of Materials | |
Component packaging | Cut Tape,Tube,Reels,Loose Parts | |
Testing | Flying Probe Test,X-ray Inspection AOI Test, High-Low Temperature Testing, Drop Testing, Salt Spray Testing, Vibration Testing | |
Turn Time | Same day service to 15 days service | |
PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing | |


















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