Hottest Sn63Pb37 Solder Spheres / Pellet are Tin/lead alloys that contain 63% Tin (Sn), 37% Lead(Pb)

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Price:$24.00 - $26.00

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Product Overview

Description


Sn63Pb37 Solder Spheres / Pellet are Tin/lead alloys that contain 63% Tin (Sn), 37% Lead(Pb)


Sn63Pb37  Solder Spheres are used by companies working with BGA, CSP, LBGA, PBGA and CBGA components who have made the transition to soldering.


Features:



  • Lowest Cost Sn/Pb

  • Excellent Fatigue Resistance

  • Compatible with all Flux Types

  • Excellent Solder Joint Reliability

  • Best Wetting Sn/Pb


The solder spheres you receive are originally manufactured solder spheres packed into jars with inert gas (nitrogen). We do not repack the solder balls we receive, so the jars you will receive have never been opened, thus ensuring the quality of the product you receive. The lid of the jar is also always sealed with a shrink-wrapped plastic wrap ensuring that the solder spheres do not oxidate in the jar.


 



  • Tin (Sn): 63%

  • Lead (Pb): 37%

  • Copper (Cu): 0.5%

  • Melting Temperature: 183°C

  • Spheroid Tolerance : Within 1.5%


Diameter Tolerance



  • 0.075mm - 0.15mm (3-6 mils) : ±0.005mm (±0.2 mils)

  • 0.20mm - 0.60mm (8-24 mils) : ±0.010mm (±0.4 mils)

  • 0.65mm - 0.76mm (25-30 mils) : ±0.015mm (±0.6 mils)



Select Diameter





























0.5mm0.457mm0.4mm0.6mm
0.635mm0.889mm0.76mm0.375mm
0.350mm0.1mm0.075mm0.125mm
0.150mm0.3mm0.25mm0.06mm

 


Sn63Pb37 BGA, CSP, LBGA, PBGA and CBGA components solder sphere solder ball solder pelletSn63Pb37 BGA, CSP, LBGA, PBGA and CBGA components solder sphere solder ball solder pellet


0.1925 s.