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PCB Assembly Capability | ||
Item | Capability | |
PCB Base Material | FR-4/ High TG FR-4/ Aluminum/ Ceramic/ Copper/ Halogen Free material/ Rogers/ Arlon/ Taconic/ Teflon | |
PCB Layers | 1-40 | |
Copper Thickness | 1-6OZ | |
Finished Board Thickness | 0.2-7.0mm | |
Min Hole Size | Mechanical hole: 0.15mm Laser hole: 0.1mm | |
Surface Treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, lmmersion Silver, Hardgold, Flash gold, OSP... | |
Outline Profile | Rout/ V-cut/ Bridge/ Stamp hole | |
Advantages | ----Intelligent Management System, Intelligent Factory | |
----Professional Surface-mounting and Through-hole soldering technology | ||
----Various sizes like 1206,0805,0603 components SMT technology | ||
----ICT(In Circuit Test),FCT(Functional Circuit Test) | ||
----PCB Assembly With IPC,CCC,FCC,Rohs Approval | ||
----High Standard SMT&Solder Assembly Line | ||
----High density interconnected board placement technology capacity. | ||
Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 100, or up to 1000 and customized | |
Type of Assembly | SMD, Through-hole, and mixed Assembly | |
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free | |
File Formate | Gerber files, Pick-N-Place file, Bill of Materials | |
Component packaging | Cut Tape,Tube,Reels,Loose Parts | |
Testing | Flying Probe Test,X-ray Inspection AOI Test, High-Low Temperature Testing, Drop Testing, Salt Spray Testing, Vibration Testing | |
Turn Time | Same day service to 15 days service | |
PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing | |
Lead Time | ||
PCB Assembly Proofing | 24 Dours | |
PCB Assembly 100 sets | 2-3 Days | |
PCB Assembly 1000 sets | 3 -5 Days | |





































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