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MG-PL-DW30L lab High quality PLC control 13.56MHz frequency vacuum plasma cleaning machine 500W adjustable medium multi-layer domestic plasma cleaning device vacuum activation Stainless steel surface treatment
MG-PL-DW30 vacuum plasma cleaning machine: Plasma is usually called the fourth state of matter. The first three states are solid, liquid and gas. They are more common and exist around us. Plasma exists on Earth only in certain environments, such as lightning and auroras. Just as it takes energy to change a solid into a gas, it takes energy to produce an ion. A certain amount of ion is composed of a mixture of charged and neutral particles (including atoms, ions and free particles). Ions can conduct electricity.
Application of plasma technology
Through the plasma bombardment on the surface of the object, it can achieve the purpose of etching, activation, cleaning and so on.Plasma surface treatment systems are now being used for cleaning and etching LCD, LED, IC, PCB, SMT, BGA, lead frame, and flat panel displays to significantly enhance the viscosity and welding strength of these surfaces. Plasma cleaned IC can significantly improve the strength of the bonding wire and reduce the possibility of circuit failure. Residual photoresistors, resins, solution residues and other organic contaminants exposed to the plasma area can be removed in a short time. PCB manufacturers use plasma etching systems for decontamination and etching to take away the insulation in the drilled holes. For many products, whether they are used in industry. In electronics, aviation, health and other industries, reliability depends on the bond strength between two surfaces. Whether the surface is metal, ceramic, polymer, plastic or a combination thereof, plasma has the potential to improve adhesion and improve the quality of the final product. The ability of plasmas to alter any surface is safe, environmentally friendly, and economical. It is a viable solution to challenging problems faced by many industries.
Principle of plasma treatment
A set of electrodes are connected with RF power supply, and high-frequency alternating electric field is formed between the electrodes. Under the agitation of alternating electric field, the gas in the region forms plasma. The active plasma performs physical bombardment and chemical reaction on the surface of the object, so that the surface material of the cleaned object becomes particles and gaseous substances, and is discharged by vacuum to achieve the purpose of surface treatment.
In the whole plasma treatment process, the factors that affect the plasma treatment effect include process temperature, RF power, gas distribution, vacuum, electrode setting, electrostatic protection and so on.
MG-PL-DW30 plasma cleaning machine
Chamber material: stainless steel surface treatment
Power supply: AC220V
Working current: The working current of the whole machine is not more than 3A(excluding vacuum pump)
Rf power supply: 0-300/0-500W adjustable
Radio frequency: 13.56MHz
Frequency offset: less than 0.2KHz
Characteristic impedance: 50 ohms, automatic matching
Vacuum degree: 1pa-30Pa
Gas path: dual gas input electronic flowmeter control
Gas flow: 10-300ml /min(adjustable)
Process control: PLC man-machine interface automatic and manual mode
Cleaning time: 1-99999 seconds adjustable
Power size 10%-100% adjustable
Inner cavity size 320 ×340×300mm 30L
Dimensions: 700×680×1250mm
Vacuum pump: BSV24 (pumping speed 6L/S)
Vacuum chamber temperature: less than 30°C
Cooling method: forced air cooling
Number of electrode plates: Singular layer: 1/3/5/7
Table 1 Selection and application of plasma cleaning technology
Plasma gas | Surface treatment technology | application | Plasma gas excitation frequency |
Ar2 | Removal of surface organic contaminants | Lead bonding, chip bonding copper lead frame, PBGA | 13. 56MHz or 2. 45GHz |
O2
| Removal of surface organic contaminants | Chip bonding | 13. 56MHz |
Surface etching | Photoresist removal | 13. 56MHz | |
| H2 | Surface oxide removal | Lead bonding, chip bonding copper lead frame, PBGA | 13. 56MHz or 2. 45GHz |
CF4 and O2 | Surface etching | Photoresist removal,CSP | 13. 56MHz |
SF6 and O2 | Surface organic material removal, film removal | 13. 56MHz or 2. 45GHz |






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Our products mainly include ball mills, tablet presses, various laboratory sintering furnaces, cutting machines, grinding and polishing machines, plasma cleaning machines, plasma coating machines, magnetron sputtering systems, thermal evaporation coating machines, high-speed spin coaters, thin film coaters, electrospinning machines, glove boxes, battery equipment, etc., which provides excellent equipment for scientific research in the fields of chemistry, physics, materials, electronics, polymer engineering, new material preparation, and research and development. We have established long-term and stable cooperative relationships with globally renowned brands to ensure that our product quality and technological advantages are always in a leading position in the industry.
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PACKAGE:
1 Standard exported package: Internal anticollision protection, external export wooden box packaging.
2 Shipping by express, by air, by sea according to customers' requirements to find the most suitable way.
3 Responsible for the damage during the shipping process, will change the damage part for you for free.
DELIVERY TIME:15-20 days after confirming order,detail delivery date should be decided according to production season and order quantity.
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2. One year free-of-charge maintenance for all the equipment
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