Factory price 99.99% Pure aluminum Ingot Lump metal Al Aluminum Round Bar customize size

Product Overview

Description

Hot Sale Customize Size Factory price99.99%- 99.999% Pure aluminum Lump metal Al Aluminum Pieces customize size for evaporation materials 

Name	Metal Aluminum Ingot/Lump
Purity	99.9%-99.995%
Size	372x74x6mm, D3x3mm,D6x6mm,D50.8x3mm, 2inch,3inch, As request
Boiling Point	2467℃
Density	2.7g/cm³
Melting Point	660.0℃
Shape	Planar target, Rotary target,Arc Cathode.
MOQ	1PCS
Application	Evaporation materials, PVD Film Coating and etc

Aluminum sputtering target has the same function as metal aluminum.Aluminium is a chemical element with the symbol Al and atomic number 13. It is a silvery-white, soft, non-magnetic and ductile metal in the boron group. Aluminium is remarkable for its low density and its ability to resist corrosion through the phenomenon of passivation. Aluminium and its alloys are vital to the aerospace industry and important in transportation and building industries, such as building facades and window frames.3N8-4N8 pure aluminum is used for rolling electrolytic capacitor aluminum foil, lighting fixtures and data storage. 5N-6N ultra-pure aluminum is used in the manufacture of semiconductor devices, fabrication of optoelectronic storage media, superconducting cable stabilization materials, and space shuttle scientific research.

Following are two micrographs of our aluminum sputtering target, the average grain size<300μm.

 

The sputtering targets we produced are high purity, it’s most important benefits are that your films possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Below form is a typically Certificate of analysis for Our aluminum sputtering target is high purity, the most important benefit is that the films will possess an outstanding level of electrical conductivity and minimized particle formation during the PVD process. Following is a typically Certificate of analysis for 5N aluminum sputtering target.

Analytical Methods:
1. Metallic elements were analyzed by GDMS and ICP-OES.
2. Gas elements were analyzed by LECO.

 

Application: Aluminum Sputtering Targets

Other Related Sputtering Targets

Metal Target	Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and rare earth targets
Alloy Target	Ni,Fe,Co,Cu,Al alloy. and special alloy
Evaporation Materials	Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and etc
Ceramic Targets	Oxide Ceramic, Compound ceramic targets.