china supplier thermal test system measuring equipments (1600886358046)

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Price:$28,800.00 - $32,000.00
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Product Overview

Description



Product Description








Product Paramenters


Type
TS560
TS560E
Temperature Range
-70 ºC to + 225 ºC
-70 ºC to + 225 ºC
Typical Temperature Transition Rate
-55 º C to + 125 º C about 10 seconds
Temperature Accuracy
± 1 ºC
Temperature Set, Display and Resolution
± 0.1 ºC
System Airflow Output
4 ~ 18 SCFM (1.9L/s ~ 8.5L/S)
4 ~ 18 SCFM (1.9L/s ~ 8.5L/S)
Operation Interface
Color touch screen;10” TFT
language
Chinese/English
Operation mode
Manual or Program
Temperature Control Methods
Environmental Internal Air TC and Remote External Type T , K;Optional :RTD
interface
RS-232,LAN;Optional:GPIB
Refrigerant
Environmental protection refrigerant
Lifting control
Lifting rod: Electric; Head: pneumatic control; Operate through local or remote interface
Arm Dimensions (Extended )
X :1500mm ;Y:550mm ;Z:360°
Cover size
Circle: Φ70mm/ Φ140mm/Φ 170mm;Oval: W70 * L140 * H60mm (customized in
various sizes)
Dimension
620mm * 1000mm * 1060mm(Length*Width*Height )
Noise
Noise   ≤ 59dB
Weight
250Kg
250Kg
Power
220VAC /50Hz,30Amp,1Phase
Air Input Requirements
Gas
Clean compressed air (need to filter grease / oil molecules / moisture / micro dust)
or nitrogen with purity ≥ 99.5%
Oil Content
Oil molecule: ≤ 0.01ppm, filtered to 0.1um oil mist pollutants
Dewpoint
< 10℃ @0.62Mpa (90PSI); Clean gas with pressure dew point less than - 20 ℃ is recommended
Input Air Temperature
+5 ºC to + 25 ºC
Input Air Pressure
90 ~ 110 PSI(0.62 ~ 0.76Mpa/6.2kg~7.6kg )
Input Air F low
18 ~ 35SCFM ( 8.5to 16.5L/s); Standard 2 8SCFM ( 13.5 L/S)
Environmental requirements
Ambient Temperature Range
+10℃ to + 25℃
Relative Humidity
5% to 85%


Application


Characteristic analysis, high and low temperature change test,
temperature impact test, failure analysis and other reliability tests, such
as:Chips, microelectronics, integrated circuits(SOC, FPGA, PLD, MCU,
ADC/DAC, DSP, etc.)Flash, UFS, eMMC PCBs, MCMs, MEMS, IGBT,
sensors, small module componentsOptical communication (e.g.
Transceiver high and low temperature testing, SFP optical module high
and low temperature testing, etc.)Other electronic industry, aerospace new
materials, laboratory research


Operator screen
Datalog screen


Test standard


* Meet the U.S. military standard MIL system test standards
* Meet the domestic military component GJB system test standard
* Meet JEDEC test requirements








Company Profile




Chengdu Zonglen Technologies CO.,LTD. is an innovative high-tech company specializing in ultra-low temperature and environmental simulation solutions, a national high-tech enterprise, an EU CE certified enterprise, an ISO9001 international quality management system certified enterprise,and an intellectual property rights implementation certification enterprise.

Zonglen mainly produces Temperature Forcing Systems (ThermoTST heat flow hood), contact type cold and heat shock machine (ATC/TCU), high and low temperature chuck, high and low temperature test bench, high pressure accelerated aging test machine (PCT), unsaturated high pressure accelerated aging test machine (HAST), Environmental stress screening system, high and low temperature circulation box, high and low temperature shock box, gas refrigerator, gas temperature controller, and ultra-low temperature refrigerator.Provide a complete set of temperature environment solutions and testing services for reliability testing in the fields of wafers, chips, 5G communications, optical module, integrated circuits, aerospace, astronomical exploration, battery packs, hydrogen energy, etc.

We have offices in Tianjin, Shanghai, Suzhou, Shenzhen, Wuhan, Chongqing, and Xi'an.Russia, the European Union, Thailand, Singapore, Malaysia, and other countries.












1600886358046
0.0128 s.