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Item(PCB) | Capability (PCB) |
Base Material | FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon |
Layers | 1-40 |
Finised inner/outer copper thickness | 1-6OZ |
Finished board thickness | 0.2-7.0mm |
Min hole size | Mechanical hole: 0.15mm / Laser hole: 0.1mm |
Controlled Impedance | +/-5% |
Plugging vias capability | 0.2-0.8mm |
Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP… |
Layer | Quick Turn /Usual Time | Mass Production |
2L | 24 hours / 4-5 days | 8-10 days |
4L | 48 hours / 6-7 days | 10-12 days |
6L | 60 hours/ 7-8 days | 12-14 days |
8L | 72 hours / 8-10 days | 16-18 days |
10L | 96 hours / 12-14 days | 18-20 days |
... | ... | ... |





Layers | Mass production: 2~50 layers |
Max. Thickness | Mass production: 472mil (10mm) |
Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ |
Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
Max. Panel Size | 1150mm × 560mm |
Aspect Ratio | 18:1 |
Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |





















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