Thermal Chuck can accommodate 300mm wafer testing instrument & equipment
- Category: Other Test Instrument >>>
- Supplier: Chengdu Zonglen Technologies Co. Ltd.
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Product Overview
Description
Product Paramenters
Type | TC200 | TC200A | TC200B | ||
Standard Temperature Range | -65 ºC to + 200 ºC | 0 ºC to + 200 ºC | 20 ºC to + 200 ºC | ||
Optional Extended Temperature Range | -65ºC to +400ºC | 0ºC to +400ºC | +20ºC to +400ºC | ||
1 Ultimate low temperature is dependent on type and temperature of coolant used. With air at +25ºC, low temperature = +20ºC; with water at +25ºC, low temperature = +5ºC.
2 Ultimate low temperature is specified at no load with the chuck maintained in a still air ambient at +25ºC maximum. Some degradation of ultimate low temperature may occur over time with larger chuck diameters. Ultimate low temperature may degrade up to 5ºC for 200mm diameter ThermoChuck configuration. Coolant line integration, routing and length will affect low temperature performance.
2 Ultimate low temperature is specified at no load with the chuck maintained in a still air ambient at +25ºC maximum. Some degradation of ultimate low temperature may occur over time with larger chuck diameters. Ultimate low temperature may degrade up to 5ºC for 200mm diameter ThermoChuck configuration. Coolant line integration, routing and length will affect low temperature performance.
Diameter | 103 mm, (4.0 inch) diameter ThermoChuck (wafers to 100 mm) 128 mm, (5.0 inch) diameter ThermoChuck (wafers to 125 mm) 154 mm, (6.0 inch) diameter ThermoChuck (wafers to 150 mm) 203 mm, (8.0 inch) diameter ThermoChuck (wafers to 200 mm) 254 mm, (10.0 inch) diameter ThermoChuck (wafers to 250 mm) 304 mm, (12 .0 inch) diameter ThermoChuck (wafers to 300 mm) |
Temperature Uniformity | ±0.5°C or ±0.5% of set temperature (whichever is greater) |
Surface | Gold, nickel plated or anodized aluminum with provisions for grounding or biasing |
Surface Electrical Isolation | >10 9 ohms at 500 V DC between surface and ground at 25°C - higher resistance construction is optional. |
Surface to Ground Capacitance | 103 mm, (4.0 inch) diameter ThermoChuck: <825 pf 128mm, (5.0 inch) diameter ThermoChuck: <1125 pf 154 mm, (6.0 inch) diameter ThermoChuck: <1575 pf 203 mm, (8.0 inch) diameter ThermoChuck: <2850 pf 254 mm, (10.0 inch) diameter ThermoChuck: <4950pf 304 mm, (12 .0 inch) diameter ThermoChuck: <7350 pf |
Height | 25.4 mm (1.0 inch) nominal |
Weight (approximate) | 103mm, (4.0 inch) diameter ThermoChuck: 0.8 kg 128mm, (5.0 inch) diameter ThermoChuck: 1.0 kg 154 mm, (6.0 inch) diameter ThermoChuck: 1.5 kg 203 mm, (8.0 inch) diameter ThermoChuck: 2.4 kg 254 mm, (10.0 inch) diameter ThermoChuck 3.0 kg 304 mm, (12 .0 inch) diameter ThermoChuck 4.2 kg |
Surface Flatness | .002 inch TIR up to +200°C |
Surface Base Parallelism | .001 inch TIR at +25°C |
Control Method | Bi-Polar DC Proportional, Integral, Derivative (PID) |
Temperature Accuracy | ±0.5°C (when calibrated against a primary or transfer standard) |
Temperature Stability | ±0.1°C |
Temperature Resolution | Set: 0.1°C Indicate: 0.1°C±0.1°C |
Ambient Operating Temperature | +10°C to +30°C |
Humidity Operating Range | 0 to 90% non-condensing |
Overheat Protect Temperature | For all systems, high temperature in system range +5°C +205°C (high temperature in range: +200°C) |
Temperature Display | Four digits, 0.1°C resolution |
Remote Control | RS-232,LAN;Optional:GPIB |
Operation Interface | Color touch screen;10" TFT |
Non-volatile Memory | Back-up retention of set up parameters |
Application
Characteristic analysis, high and low temperature change test,
temperature impact test, failure analysis and other reliability tests, such
as:Chips, microelectronics, integrated circuits(SOC, FPGA, PLD, MCU,
ADC/DAC, DSP, etc.)Flash, UFS, eMMC PCBs, MCMs, MEMS, IGBT,
sensors, small module componentsOptical communication (e.g.
Transceiver high and low temperature testing, SFP optical module high
and low temperature testing, etc.)Other electronic industry, aerospace new
materials, laboratory research
temperature impact test, failure analysis and other reliability tests, such
as:Chips, microelectronics, integrated circuits(SOC, FPGA, PLD, MCU,
ADC/DAC, DSP, etc.)Flash, UFS, eMMC PCBs, MCMs, MEMS, IGBT,
sensors, small module componentsOptical communication (e.g.
Transceiver high and low temperature testing, SFP optical module high
and low temperature testing, etc.)Other electronic industry, aerospace new
materials, laboratory research
Test standard
* Meet the U.S. military standard MIL system test standards
* Meet the domestic military component GJB system test standard
* Meet JEDEC test requirements
* Meet the domestic military component GJB system test standard
* Meet JEDEC test requirements
Company Profile
Chengdu Zonglen Technologies CO.,LTD. is an innovative high-tech company specializing in ultra-low temperature and environmental simulation solutions, a national high-tech enterprise, an EU CE certified enterprise, an ISO9001 international quality management system certified enterprise,and an intellectual property rights implementation certification enterprise.
Zonglen mainly produces Temperature Forcing Systems (ThermoTST heat flow hood), contact type cold and heat shock machine (ATC/TCU), high and low temperature chuck, high and low temperature test bench, high pressure accelerated aging test machine (PCT), unsaturated high pressure accelerated aging test machine (HAST), Environmental stress screening system, high and low temperature circulation box, high and low temperature shock box, gas refrigerator, gas temperature controller, and ultra-low temperature refrigerator.Provide a complete set of temperature environment solutions and testing services for reliability testing in the fields of wafers, chips, 5G communications, optical module, integrated circuits, aerospace, astronomical exploration, battery packs, hydrogen energy, etc.
We have offices in Tianjin, Shanghai, Suzhou, Shenzhen, Wuhan, Chongqing, and Xi'an.Russia, the European Union, Thailand, Singapore, Malaysia, and other countries.
Zonglen mainly produces Temperature Forcing Systems (ThermoTST heat flow hood), contact type cold and heat shock machine (ATC/TCU), high and low temperature chuck, high and low temperature test bench, high pressure accelerated aging test machine (PCT), unsaturated high pressure accelerated aging test machine (HAST), Environmental stress screening system, high and low temperature circulation box, high and low temperature shock box, gas refrigerator, gas temperature controller, and ultra-low temperature refrigerator.Provide a complete set of temperature environment solutions and testing services for reliability testing in the fields of wafers, chips, 5G communications, optical module, integrated circuits, aerospace, astronomical exploration, battery packs, hydrogen energy, etc.
We have offices in Tianjin, Shanghai, Suzhou, Shenzhen, Wuhan, Chongqing, and Xi'an.Russia, the European Union, Thailand, Singapore, Malaysia, and other countries.
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