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Material | CEM-1/3, FR4, Ceramic, Aluminum, PI, PET, Rogers |
Layers | 1-32 layers |
Final PCB Thickness | 0.2mm-6.0mm(8mil-126mil) |
Finish copper thickness | 0.5-12oz |
Min.Hole Size | 0.1mm (4mil) |
Min Line width | 0.1mm (4mil) |
Surface Finishes | HASL – Leaded Solder Tin/Nickel HASL – Lead Free Solder Electroless Soft Gold Wire Bondable Soft Gold Nickel Flash Gold Electroless Nickel Immersion Gold/ Silver/ Tin OSP Carbon Ink |
Assembly | SMT, THT |
Min.Finished Hole Diameter | 0.15mm |
PTH Tolerance | ±0.05mm |
Copper Thickness Of Hole | 20-25um |
Max.Aspect Ratio | 10:1 |
Hole Position Tolerance | +/-2mil |
Outline Tolerance | Normal:+/-5mil Special:+/-4mil |
Tolerance of tracks | +/-20% |
PTH Tolerance | Normal:+/-3mil Special:+/-2mil |
NPTH Tolerance | +/-2mil |
Impedance Control | +/-10% |
Twist and Bow | <=0.75% |
Thermal Conductivity(w/mk) | 1.0; 2.0; 3.0; 10.0-80.0 |
PCB Test | 100% Test |
PCB Test Equipments | 5 Flying Probe Test machines 6 Test Jig machines |
PCBA Test | 100% AOI Test |