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Material Properties of Aluminum Nitride Substrate/Wafer | ||
Property Content | Property Index | |
Density(g/cm³) | 3.335 | |
Resistance to Thermal Shock | No Cracks | |
Thermal conductivity(30℃, W/m.k) | ≥170 | |
Linear expansion coefficient (/℃, 5℃/min, 20-300℃) | 2.805×106 | |
Flexural strength (MPa) | 382.7 | |
Volume Resistivity (Ω.cm) | 1.4×1014 | |
Dielectric constant(1MHz) | 8.56 | |
Chemical Durability (mg/cm²) | 0.97 | |
Dielectric strength (KV/mm) | 18.45 | |
Surface roughness Ra(μm) | 0.3~0.5 | |
Camber (length‰) | ≤2‰ | |
Appearance/ Color | Dense/ Dark Gray | |
Note: The general characteristics of the materials described above were derived from laboratory test performed by Innovacera from time on sample quantities. Actual characteristics of production lots may vary. | ||





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