The performance and the application:
This series of products can be covalent and non covalent functionalization, so it can be widely used in composite materials, optoelectronic materials and devices and biomedicine fields.
This series of products with a thickness of 1~20nm, chip size is 1~50 um, stably dispersed in various organic solvents in the high-speed stirring or ultrasonic conditions, with high specific surface area and higher thermal conductivity properties, thus can improve the material corrosion and high temperature characteristics, can be used as conductive agent (plastic, coating, rubber), antistatic material, electrode material (chemical power source, sensors, solar cells, fuel cells) and catalyst carrier etc..
Thermal management and heat spreading
EMI Shielding
Electrodes for batteries and super capacitors
Conductive substrate for bio-sensors
Resistance heating
High-barrier packaging
Reinforcement for composites
Water treatment
Product packaging, storage and transportation:
1. Packaging: plastic bottles, plastic bags or bottled.
2. Storage: This product should avoid light sealed in a dry environment, and the temperature is not higher than 35 degree centigrade. With no toxic and harmful gases, volatile matter and pollution source contact. Keep away from fire.
3.transportation: in the process of transportation, avoid sunlight and damp, prohibition and hard mixed, forbid throwing, light light unloading.
Safety precautions:
Need to wear proof mask the use of the process, to avoid direct contact with the skin.