Hot Pressed Aluminum Nitride Ceramic Black Wafer
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- Supplier: Xiamen Innovacera Advanced Materials Co. Ltd.
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Product Overview
Description
Hot pressed alumiunm nitride is used in applications requiring high electrical resistivity in additional to exceptional thermal conductivity.The application for hot pressed AlN typically involve rigorous or abrasive environments and high-tempreature thermal cycling.
Application:
--Semiconductor Heaters
--Etching Machine
Below is the properties of the pressed alumina nitride.
--Etching Machine
Below is the properties of the pressed alumina nitride.
Property | Units | Value |
Flexural Strength, MOR (20 °C) | MPa | 300-460 |
Fracture Toughness | MPa m1/2 | 2.75-6.0 |
Thermal Conductivity (20 °C) | W/m K | 80-140 |
Coefficient of Thermal Expansion | 1 x 10-6/°C | 3.3-5.5 |
Maximum Use Temperature | °C | 800 |
Dielectric Strength (6.35mm) | ac-kV/mm | 16.0-19.7 |
Dielectric Loss | 1MHz, 25 °C | 1 x 10-4 to 5 x 10-4 |
Volume Resistivity (25°C) | Ω-cm | 1013 to 1014 |
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