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Hotair vacuum soldering system KD V400 IGBT assembly line with vacuum packaging solder reflow oven
Hotair vacuum soldering system KD-V400 IGBT assembly line with vacuum packaging solder reflow oven
Hotair vacuum soldering system KD-V400 IGBT assembly line with vacuum packaging solder reflow oven
Hotair vacuum soldering system KD-V400 IGBT assembly line with vacuum packaging solder reflow oven
Hotair vacuum soldering system KD-V400 IGBT assembly line with vacuum packaging solder reflow oven
Hotair vacuum soldering system KD-V400 IGBT assembly line with vacuum packaging solder reflow oven
Hotair vacuum soldering system KD-V400 IGBT assembly line with vacuum packaging solder reflow oven

Hotair vacuum soldering system KD V400 IGBT assembly line with vacuum packaging solder reflow oven

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Price:$410,000.00 - $420,000.00

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Product Overview

Description





Products Description


IGBT module vacuum reflow oven KD-V400




Product Paramenters


Name
Vacuum Reflow Oven
Model
KD-V400
Welding size
350*400MM
Oven size (LxWxH)
3950*1960*1900mm Connected unloader size:4580*1960*1900 mm
Weight
2900 kgs
Heating zones
Front two preheating zones, Middle is Reflow zone, Behind are 4 Cooling chambers. Each temperature zone independent vacuum,
Independent temperature control system. Products left in -right out, inline working.
Compatible Process
Solder paste and Preform solder
Gas
Nitrogen; Formic acid
Feed in and out
With 0.6m uploader,1.2m unloader , Air-cooling with time setting
Track
Length:330mm，Adjustable;Height:950±20mm;Carring capacity≥20kg
Effectively heating space
(280mm*190mm)*2 heating zone ,H≥80mm；
Height of Chamber
80mm
Max temperature of Preheating zone and Reflow zone
≥400℃;Accuracy:±1℃；
Bottom welding temperature
≥450℃
Top welding temperature
Max 300℃
Heating way
Bottom contact-type heating conduction
Cooling way
Bottom contact-type cooling
Type of Vacuum pump. Speed
With 4 oil pump( 2 Preheating zones/Reflow zone/Cooling zone,) Speed ≥100m3/h;
Min Vacuum
2 Preheating zone/Reflow zone/ Cooling zone ≤1mbar; Within2h≤5mbar；
Speed of Heating and Cooling
Max heating speed≥3℃/s; Max cooling speed≥3℃/s。
Accuracy of Soldering temperature
Temperature of Reflow tray:±2%
Max hold time of reflow temperature
≥60min,(Max：999s)；
Void Rate
Whole Void rate ≤2% Chip size (10mm*10mm),Sigle Void rate≤1% ,Chip size:(10mm*10mm)
Cooling Water
With independent circulating cooling water system
Temperature curve
Can setting self,(Add/Modify/Delete and so on)
Chamber with watch window
Chamber with watch window
Power
Max:35KW Working powe:12-15KW
Heating platform
Red copper special treatment
Power standard
380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire
Gas
Nitrogen ,Formic acid
Control system
Siemens PLC1200 control system +YanHua IPC +Software operate


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