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Pcb Assembly Capability | ||
Single and double sided SMT/PTH | Yes | |
Large parts on both sides, BGA on both sides | Yes | |
Min Chips size | 01005 | |
Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 | |
Min Leaded parts pitch | 0.008 in. (0.2 mm) | |
Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. | |
Assembly surface mount connectors | Yes | |
Odd form parts:Resistor and capacitor networks/ Electrolytic capacitors/Variable resistors and capacitors (pots)/Sockets | Yes | |
Wave soldering | Yes | |
Max PCB size | 14.5 in. x 19.5 in. | |
Min PCB Thickness | 0.02 | |
Fiducial Marks | Preferred but not required | |
PCB Shape | Any | |
Panelized PCB | Tab routed/Breakaway tabs/V-Scored/Routed+ V scored | |
Inspection | X-ray analysis/Microscope to 20X /100% AOI testing | |
Rework | BGA removal and replacement station/SMT IR rework station/Thru-hole rework station | |
Min IC Pitch | 0.2mm | |
solder paster printer | 0.2mm | |
POP Manufacturing capability | POP *3F | |














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