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Company Capability | ||||||||
Layers | 1-40 layers | |||||||
Copper Thickness | 0.5-6OZ | |||||||
Material | FR4(Shengyi China, ITEQ, KB A+, HZ), HI-TG, FR06, Rogers, Taconic, Argon, Nalco, Isola and so on | |||||||
Solder Mask | green, yellow, white, blue, black, red | |||||||
Finished Surface | conventional hasl, lead free hasl, immersion gold, immersion tin, immersion silver, hard gold, OSP... | |||||||
Silkscreen color | white, black | |||||||
Products Type | HF(High-Frequency)&(Radio Frenquency)board, impendance controlled board, HDI board, BGA&Fine pitch board | |||||||
Minimum line width/gap | 3.5/4mil(laser drill) | |||||||
Minimum hole size | 0.15mm(mechanical drill)/4mil(laser drill) | |||||||
Minimum Annlar Ring | 4mil | |||||||
Max Copper thickness | 6OZ | |||||||
Min Solder Mask Bridge | 0.08mm | |||||||
Plugging Vias capability | 0.2-0.8mm | |||||||




Project (PCB) | Capability (PCB) |
base material | FR-4 / High TG FR-4 / Halogen-free |
Number of layers | 1-40 |
Copper thickness | 1-6 ounces |
Finished board thickness | 0.2-7.0mm |
Minimum aperture | Mechanical hole: 0.15mm Laser hole: 0.1mm |
controlled impedance | +/-5% |
surface treatment | Spray tin, lead-free spray tin, immersion gold, immersion tin, immersion silver, hard gold, flash gold, OSP... |
solder mask | Green/Blue/Black/White/Red/Pink/Orange/Yellow |
Plugging ability | 0.2-0.8mm |
outline outline | Milling/V-cut/Bridge/Stamp Hole |


Lead Time | ||
layer | Fast forward/normal time | mass production |
2 layer | 24 hours/4-5 days | 8-10 days |
4th floor | 24 hours/4-5 days | 10-12 days |
Level 6 | 72 hours/7-8 days | 12-14 days |
8th floor | 72 hours/8-10 days | 16-18 days |
10th floor | 96 hours/12-14 days | 18-20 days |
... | ... | ... |





delivery time | standard Time | urgent order |
Prototype<20 pieces | 2 days | 8 hours |
Small batch 20-100 pieces | 6 days | 24 hours |
Medium quantity 100-1000 pcs | 10 days | 3 days |
Mass production>1000 pieces | Depends on the component | Depends on the component |

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