Low Viscosity RTV2 Potting Compound for Electronic Ballasts PCB Box Electronic Liquid Polyurethane Transparent Silicone

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Product Overview

Description





Technical Parameter


No.
Test item
Test standard
Unit
Product test results
Component A
Component B
Before curing
1
Exterior
Visual inspection
---
grey fluid
white fluid
2
Viscosity
GB/T10247-2008
25ºC,mPa·S
4500~5000
4500~5000
3
Density
GB/T 13354-92
25ºC,g/cm3
1.50±0.05
1.50±0.05
4
The mixing ratio
(A:B)
1:1
weight ratio
100
100
Volume ratio
100
100
5
Operation time
Measured
hr
0.3-0.4
6
Curing Conditions
Measured
hr
4~12 (25ºC,Preliminary curing)
0.20 (80ºC)
After curing
7
Appearance
Visual inspection
---
grey elastomer
8
Hardness
GB/T 531.1-2008
Shore A
50±5
9
Coefficient of Thermal Conductivity
GB/T10297-1998
w/m·k
≥0.76
10
Expansion Coefficient
GB/T20673-2006
µm/(m,ºC)
210
11
Bibulous Rate
GB/T 8810-2005
24h,25ºC,%
0.01~0.02
12
Resistivity of Volume
GB/T 1692-92
(DC500V),Ω· cm
1.0×1016
13
Dielectric Strength
GB/T 1693-2007
Kv/mm(25ºC)
18~25
14
Temperature Resistance
Measured
ºC
-50~+250


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