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Good Quality Hotmelt Hot Melt Adhesive Woodworking Glue
PRODUCT DETAIL
| Substrate Moisture | 8-12% |
| Operating Environment | Temperature: 15~30℃ Moisture: 55-75% |
| Working Temperature | 130-140℃ (SUMMER), 140-150℃ (WINTER) The ultimate-use temperature is obtained from debugging. |
| Feed Speed | 10-20m/min |
| Glue Spread | 150-200g/m² (higher amount can slow the dry speed while lower can cause glue failure) |
| Pressure Relief Time | 24 -72 hours |
| Attention | 1. The surface of edge-banding substrate must be free of dust, oil & grease, and processed with the constant temperature & humidity treatment. 2. Edge-bandling substrate structure, operating environment and process directly influence the bonding results, so trial application is advisable. |


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