Titanium Rotary Sputter Target Metal Ti Rotary Target for E Beam Evaporation Materials

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Titanium Rotary Sputter Target Metal Ti Rotary Target for E-Beam Evaporation Materials

Hot Sale Customize Size Titanium Rotary Sputter Target Metal Ti Rotary Target for E-Beam Evaporation Materials Price

 

Name	Metal Titanium Rotary Targets Ti Sputtering Targets
Purity	99.9%-99.995%
Size	D3x3mm, D6x6mm, 10x10x10mm 2inch,3inch, As request
Boiling Point	3530℃
Density	4.54g/cm³
Melting Point	1720.0℃
Shape	Planar target, Rotary target.Pellets, Cube
MOQ	1kg/1pc
Application	Evaporation materials, PVD Film Coating and etc

The titanium sputtering target is made of titanium metal.As a metal, titanium is recognized for its high strength-to-weight ratio. It is a strong metal with low density that is quite ductile (especially in an oxygen-free environment), lustrous, and metallic-white in color. The relatively high melting point (more than 1,650 °C or 3,000 °F) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductivity.

Titanium sputtering targets and arc cathodes with Industrial grade are used for decorative coating to deposit golden, yellow, and golden yellow color. With up to 99.7% purity, uniform grain size, lower gas content, end user can obtain good hardness, high brightness, corrosion and oxidation resistant color without discolor and tarnish for a very long time. We have been supplying Titanium Sputtering Target or Titanium arc cathodes for manufacturers of watch, sanitary ware, car mirrors, etc, which are suitable for various magnetron sputtering machines and ionic plating machines.

High purity Titanium Sputtering Targets with up to 99.999% pure are usually used for integrated circuit, DRAMS and flat panel display application. When LSI, VLSI, and ULSI line networks are sputtered with high-purity titanium, these integrated components can be made light, thin, small in size, and dense in wiring. High purity titanium target can also be used as barrier metal material

The microstructure can be adjusted by our flexibility production process, to achieve your desired effect. If the grains of the sputtering target are uniformly aligned, the user can benefit from constant erosion rates and homogeneous layers. Following are two micrographs of our titanium sputtering target, the average grain size<20μm.

 

 

Application: Nickel Metal Granules 

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Other Related Sputtering Targets

Metal Target	Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and rare earth targets
Alloy Target	Ni,Fe,Co,Cu,Al alloy. and special alloy
Evaporation Materials	Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and etc
Ceramic Targets	Oxide Ceramic, Compound ceramic targets.