F23BUUM13-W2 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is
12.9mm*12.19mm with module thickness of 1.6mm. It can be easily manufactured on SMT process and highly suitable for tablet PC,
ultra book, mobile device and consumer products. It provides USB interface for WiFi to connect with host processor and high speed
USB interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT
controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n technology and can support
BT2.1+EDR/BT3.0 and BT4.0. F23BUUM13-W2 uses Realtek RTL8723BU, a highly integrated WiFi/BT single chip based on advanced COMS process. RTL8723BU integrates whole WiFi/BT function blocks into a chip, such as USB, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB.












