Embedded Brilliance: IMX8MM Cortex A53 Board for Superior Performance

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Product Overview

Description



Products Description


N-XP i.mx8m-mini quad core processor intergrated circuit low power som module development hardware PCBA board
The i.MX8MMini series processors use an advanced quad-core Arm®Cortex®-A53 core, which runs at speeds up to 1.8 GHz. And a general-purpose Cortex®-M4 400 MHz core processor is used for low-power processing. The DRAM controller supports 32-bit/16-bit LPDDR4, DDR4 and DDR3L memories. Besides, a variety of audio interfaces are available, including I2S, AC97, TDM and S/PDIF.


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Application area




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Hardware Resources

CPU
NXP i.MX8M Mini processor,Quad ARM® Cortex™-A53+Cortex-M4, 1.8 GHz of i.MX8M, 400MHz of Cortex®-M4
RAM
1GB LPDDR4 ( up to 2GB LPDDR4)
Flash
8GB EMMC, ( up to 16GB EMMC、32GB EMMC)


Network
1-ch AR8035 Internet chip adopts RGMII supporting adaptability l10M/100M/1000M

1-ch LAN 7430 port chip, supporting 10M/ 100M/1000M

Onboard WIFI (AP6236)

Communication
4-ch RS232, 2 port as the debug UART

4-ch USB 2.0, 1-ch USB-OTG

2-ch CAN 2.0
Display
4-ch MIPI each Display channel’ s resolution up to 1920 * 1200
Audio
McASP audio interface; binaural output; MIC audio input

Input
Standrad I2C Capacitive panel

1-ch CSI camera interface (4-ch)
Expansion
Interface
MINI-PCIE interface with SIM socket for 4g module
Memory Interface
1-ch SD card
Expansion Interface
GPIO interface
Other
Reset circuit, Watch dog, RTC, Buzzer, JTAG interface
Power Input
+12V power supply






Resource


Development
Tools
Development environment: Virtual Machine VM9.0.2+ubuntu12.04.1 or Ubuntu 14.04

Application layer development debug tool

Cross-compiler

Common terminal development debugging tool
Image File
ISO of matched operating system
Test Program
Interface using demo test program and test program source code
Source Code
Bootloader, kernel, system source code
Manual
Mainboard User manual,Hardware Manual, Device Manual
Mechanical Chart
Back Plane’s Structure & Size





Electrical Specification

Size
Core Board:55mm*60mm, 8-layer high precision immersion gold process

Back Board: 200mm*130mm,4-layer high precision immersion gold process
Power Consumption
≤5W
Operation Temperature
-40℃ ~ +85℃ ( industrial level ),0℃ ~ +85℃ (Consume Level, According to customers’ requirements)
Operation Humidity
5% ~ 95%, Non-Condensing
Operate System
Linux4.14.98+QT5.10.1
Android




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