GRANDSEED best quality Automatic SMT Wave soldering GSD WD350CE DIP Wave Soldering Machine

Product Overview

Description

 

GSD-WD350CE SPECIFICATIONS
ITEMS	MODEL
Control style	PC+PLC ( GRANDSEED PCBASE WAVE SOLDERING CONTROL SOFEWARE V1.0)
Conveying motor	1P  AC220V,60W
Conveying speed	0~2000mm/min
PCB size	30~350mm(W)
Pre-heating zone	1800mm 3 sections PID controlled individual hot air, zone temperature ~250℃
Solder pot temperature	1KW * 12PCS  zone temperature~300℃
Solder pot capacity	≈480KG
Solder wave height	0~12MM
Solder wave motor	3P  AC220V,0.18KW * 2PCS
Finger cleaning pump	1P  AC220V 6W
Conveying direction	Left→right
Soldering angle	3 ~ 6 º
Flux pressure	3 ~ 5 BAR
Power supply	AC380V 50HZ
Normal working power/total power	8KW/32KW
Outside dimension	4535(L)*1600(W)*1700(H)MM
Machine dimension	3800(L)*1600(W)*1700(H)MM
Net weight	1800KG

 

 

Features of GSD-WD350CE Soldering series

1.The PCB board enters and automatically starts soldering. After soldering is completed, the wave peak automatically stops. (Patent No. ZL 2010 2 0056206.3)

2.The solder pot is independently designed for lead-free environmental protection, making it convenient for lifting and entry/exit, and safe, and easy to clean,

3. the solder pot is made of high quality ductile iron+surface enamel treatment and insulated with aluminum silicate insulation material. When the temperature inside is 270 ℃ and the temperature outside the furnace is ≤ 60 ℃, the insulation effect is good and the safety is high. 

4. Fast heating and automatic on/off time design. The tin furnace can be produced within 120 minutes of heating time.

5. The solder pot adopts imported high-temperature motors, stepless frequency conversion speed regulation, independent control, and stable peak performance;

6. The heating of the solder pot adopts a high-speed PID external heating two-stage independent control, which heats up quickly and solves the problem of tin explosion in the tin furnace;

7. The tin furnace nozzle can be adjusted according to the width of the PCB board you want to pass through, reducing the area of ineffective welding and keeping the contact area between solder and air small, greatly reducing the oxidation of solder. The tin bars contain different impurities, and there may be deviations in the tin slag. Suitable for various lead-free solder materials such as Sn/Ag/Cu, Sn/Zn, and Sn/Cu, with a tin slag oxidation rate of 0.8-2.0 KG every 8 hours (depending on the size of the PCB board)

8. The machine Increases diversion channels and anti oxidation sleeves to reduce black powder and tofu residue like oxides.

9. The design is reasonable, and the tin slag is automatically collected. Cleaning the tin furnace is simple, convenient, and safe, without the need to scoop up the tin slag every day. It can be cleaned once a week or longer according to the situation.