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PCBA Customization and Production Capacity PCBA定制和生产能力 | ||||||||
SMT Lines SMT 生产线 | 4 Lines 4 行 | |||||||
Capacity 能力 | 400000m2 400000米2 | |||||||
Max Board Size 最大板尺寸 | 680*550mm Smallest:0.25"*0.25" | |||||||
Min Components size 最小组件大小 | 0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP 0201-54 sq.mm (0.084 sq.inch),加长型连接器,CSP,BGA,QFP | |||||||
Speed 速度 | 0.15sec/chip, 0.7sec/QFP 0.15 秒/芯片,0.7 秒/QFP | |||||||
Min. Line Width 最小线宽 | Customized 定制 | |||||||
OEM/ODM | Available 可用 | |||||||
Board Thickness 板厚 | 0.2mm-3.6mm 0.2 毫米-3.6 毫米 | |||||||
Surface Treatment 表面处理 | HASL/OSP/ENIG | |||||||
Copper Thickness 铜厚 | 1OZ/2OZ/3OZ/4OZ/5OZ 1 盎司/2 盎司/3 盎司/4 盎司/5 盎司 | |||||||
Base Material 基材 | 94HB/94VO/FR4/22F/CEM-1/HDI/Aluminum 94HB / 94VO / FR4 / 22F / CEM-1 / HDI /铝 | |||||||
Application 应用 | Consumer Electronics, Communication Equipment, Automotive Electronics, Medical Equipment, Industrial Control Equipment 消费电子, 通讯设备, 汽车电子, 医疗设备, 工业控制设备 | |||||||
Assembly Types 组件类型 | SMT,DIP(Manually / Automatic soldering)and wave-soldering SMT、DIP(手动/自动焊接)和波峰焊 | |||||||
Component Packaging 组件封装 | Cut Tape,Tube Reels Loose,Parts | |||||||
Lead Time 提前期 | 7-15 Working Days 7-15 个工作日 | |||||||
Testing 测试 | Flying probe,VISual inspection,AOI inspection ,X-ray for BGM,programming and function testing under your instructions. 飞针、视觉检测、AOI 检测、BGM X 射线、编程和功能测试在您的指导下进行。 | |||||||




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