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CAPABILITIES OF TURNKEY PCB ASSEMBLY | ||
Capability | Standard | |
Certifications: | ISO14001:2015, ISO9001:2015, ISO13485:2016, ROHS, UL 94v0, IPC-600G classll and IPC-6012B classll | |
Lead Time: | 3-15 Days, As per the scheduled period | |
Ports Procurement: | Full Turnkey, Partial Turnkey, and Kitted | |
Assembly Types: | Surface Mount (SMT), Through-hole, Mixed Technology. Single and doubl-sided SMT/PTH. | |
Stencils: | Laser cut stainless steel and Nano-coating | |
Components: | Possive components smallest size 01005, Fine pitch components smallest size 8 Mils pitch. | |
Component Packaging: | Reels, Cut Tape, Tube, and lose parts. | |
Inspection: | X-ray analysis, AOI, and Microscope to 20X | |
Solder Type: | Leaded and Lead- free/ RoHS compliant | |
Assembly Surface Mount Connectors: | Yes | |
Wave Soldering: | Yes | |
PCB Finish: | HASL Electrolytic Gold, Electroless gold, Electroless silver, Immersion gold, Immersion silver, Immersion tin, and OSP. | |
Ponelized PCB: | Tab routed, Breakaway tobs, V-scored and Routed + V scored | |
Rework: | BGA removal and replocement station, SMT IR rework station, and Through-hole reworks station. | |
Design File Format: | Gerber RS 27.274D, Eogle and Auto CAD's DXF, DWG BOM, and Pick and place file | |

Specs and Tolerances | ||||
Min. FR4 PCB Thickness | ||||
Loyer Count | Typical Value (mm) | Utimate Volue (mm) | ||
1-layer&2-layer | 0.40 | 0.20 | ||
4-layer | 0.40 | 0.30 | ||
6-layer | 0.60 | 0.40 | ||
8-layer | 1.00 | 0.80 | ||
10-layer | 1.20 | 1.00 | ||
12-layer | 1.80 | 1.20 | ||
14-layer | 2.20 | 1.60 | ||
16-layer | 2.50 | 1.80 | ||
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