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PCB CAPABILITY | ||||||
ITEM | RIGID PCB | FPC | Rigid-Flex PCB | |||
Max layer | L40 | L8 | L18 | |||
Max panel size | 22.5x32inch | 9x14inch | 22.5x32inch | |||
Min board size | 5x5mm | 5x10mm | 10x10mm | |||
Min trace width/gap | 3/3mil | 3/3mil | 3/3mil | |||
Max copper weight(outer layer) | 12OZ | 2OZ | 3OZ | |||
Max copper weight(inner layer) | 6OZ | 2OZ | 6OZ | |||
Layer to layer registration | ±3mil | ±3mil | ±3mil | |||
Max aspect ratio(mechanical drilling) | 20:1 | / | / | |||
Max aspect ratio(laser drilling) | 1:1 | / | / | |||
PTH tolerance(standard) | ±3mil | ±3mil | ±3mil | |||
PTH tolerance(press fit) | ±2mil | ±2mil | ±2mil | |||
NPTH tolerance | ±2mil | ±2mil | ±2mil | |||
Board thickness | 0.2-7.0mm | 0.1-0.5mm | 0.4-3.0mm | |||
Min PTH (mechanical drilling) | 0.15mm | 0.1mm | 0.15mm | |||
Min PTH (laser drilling) | 0.1mm | 0.1mm | 0.1mm | |||
Hole wall copper | 0.4-2mil(10-50um) | 0.4-2mil(10-50um) | 0.4-2mil(10-50um) | |||
Impedance tolerance | ±10% | ±10% | ±10% | |||
Thickness tolerance(<1.0mm) | ±0.1mm | ±0.05mm | ±0.1mm | |||
Thickness tolerance(>=1.0mm) | ±10% | / | ±10% | |||
Min BGA size | 7mil | 7mil | 7mil | |||
Finish treatment | HAL,ENIG,Immersion Tin, Immersion Silver,Selective Hard Gold, OSP, EIEPIG, Gold Fingers | ENIG,Immersion Tin, Immersion Silver,Selective Hard Gold, OSP, EIEPIG, Gold Fingers | HAL,ENIG,Immersion Tin, Immersion Silver,Selective Hard Gold, OSP, EIEPIG, Gold Fingers | |||
Solder mask color | green,blue,black,yellow,red,purple,white | green,blue,black,yellow,red,purple,white | green,blue,black,yellow,red,purple,white | |||
Min solder mask dam | 3mil | 8mil | 3mil | |||
Silkscreen color | white,yellow,black,red | white,yellow,black,red | white,yellow,black,red | |||
Min silkscreen width/height | 4/23mil | 4/23mil | 4/23mil | |||
Warp & twist | 0.75% | 0 | 0.75% |
PCBA CAPABILITY | ||||
Stencil size range | 29x29inch | |||
SMT | Position accuracy:25um | |||
Components size:0201-150mm | ||||
Max.PCB size:680x500mm | ||||
Min.PCB size:50x50mm | ||||
Min.PCB thickness:0.3-6.0mm | ||||
Min.IC pitch:0.3mm | ||||
Wave-solder | Max.PCB width:450mm | |||
Min.PCB width:no limited | ||||
Component height:Top 120mm/Bottom 15mm | ||||
Min.BGA pitch | 0.08" | |||
Max.BGA size | 74x74mm | |||
BGA ball pitch | 1.00mm(min),3.00mm(max) | |||
BGA ball diameter | 0.4mm(min),1.00mm(max) | |||
QFP lead pitch | 0.38mm(min),2.54mm(max) | |||
Testing | X-Ray,AOI,Microscope to 20X | |||
ICT,Function test,Temperature cycling | ||||
Frequency of stencil cleaning | 1 time/5-10 PCS |
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