To achieve mass production of slimming LCD glass substrates, there are 2 representative methods: “mechanical grinding” and “chemical etching”.
In recent days, chemical etching has been the mainly adopted method for its superiority in processing each glass substrate with a short takt time.
Among several different methods to perform chemical etching, in order to handle those LCD glass substrates growing larger in size, NSC Engineering chooses to design & fabricate single substrate chemical etching machines on which the glass substrates are conveyed in a horizontal lying position.
Features of ultra-thin glass slimming machine
Our glass etching machine carries forward the glass substrates which are laid flat on the conveyor and at the same time sprays etchant (strong acid) onto these glass substrates. In this way, workpieces can be conveyed and slimmed simultaneously. Total thickness of 0.05 mm or less can be realized after finishing the process.
Uses
Mobile devices which demand thinner and lighter glass substrates.
Available product size
730x920mm
Production capacity
13,300sheet/mth
Company Profile
NSC ENGINEERING CO.,LTD.
Our predecessor, Shinwa Co., Ltd. was an device maker specializing in wet process chemical device established in 1978. In 2018, NSC Engineering was launched after receiving a business transfer from Shinwa.
NSC Group is a specialist of metal and glass surface treatment that uses chemicals. In addition to 40 years of know-how in the design and manufacture of wet process devices, we have unique surface treatment technologies using inorganic, organic chemical and electrochemical.
Our main products are Photoresist coating/ developing/ etching/ stripping/ washing machines, and electropolishing machines.