Safe clean highly reliable premium waterproof metal bonding adhesive /AG 1A/AG 1B2
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- Supplier: PELNOX LTD.
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Product Overview
Description
Products Description
Fast-curing adhesives at room temperature AG-1A/AG-1B2
AG-1A/AG-1B2 is a two-component mixed (liquid resin and liquid hardener) epoxy resin adhesive.
Excellent fast curing at room temperature. It has good impact resistance and is used for bonding microspeakers.
Since it can be cured at room temperature, it is suitable for bonding heat-sensitive base materials.
It has a proven track record of use in electronic components and is highly reliable.
It can be used for a wide range of applications including rubber, plastic, metal, and wood.
Small trial samples are also available, so please inquire.
(2) Application
Applications that require fast curing at room temperature, bonding of heat-sensitive materials, and bonding of electronic components such as microspeakers.
Applications that require fast curing at room temperature, bonding of heat-sensitive materials, and bonding of electronic components such as microspeakers.
(3) Compliant for environment regulation
This product does not contain organic solvents, making it a safe and clean adhesive.
It can be used to comply with the RoHS Directive, which is required for electronic components.
This product does not contain organic solvents, making it a safe and clean adhesive.
It can be used to comply with the RoHS Directive, which is required for electronic components.
(4) Product information
As supplied （Typical Value）
Item | Condition | Unit | AG-1A | AG-1B2 | ||||||
Appearance | visual | ー | Light yellow | Light brown | ||||||
Specific Gravity | 25℃ | ー | 1.20 | 1.10 | ||||||
Viscosity | 25℃ | mPa・s | 4,500 | 4,700 | ||||||
Mixing Ratio | parts by weight | 100/100 | ||||||||
Gel time | 3g, 25℃ | minute | 3 | |||||||
As cured
Item | Condition | Unit | Typical Value | ||||||
Hardness | JIS K-7215 25℃ | shore D | 80 | ||||||
Glass Transition Temperature | TMA | ℃ | 40 | ||||||
Coefficient of Thermal Expansion | below Tg | 10-5/℃ | 6.7 | ||||||
above Tg | 10-5/℃ | 19.6 | |||||||
Flexural Strength | JIS K-6911 | MPa | 81 | ||||||
Flexural Modulus | JIS K-6911 | MPa | 2,200 | ||||||
Tensile Strength | JIS K-7161 | MPa | 40 | ||||||
tensile modulus | JIS K-7161 | MPa | 1,130 | ||||||
Volume Resistivity | JIS K 6911 25℃ | Ω-cm | 1.2 x 1014 | ||||||
JIS K 6911 boil for 2hrs | Ω-cm | 3.2 x 108 | |||||||
Water Absorption | JIS K 6911 boil for 2hrs | wt% | 3.2 | ||||||
Shear Adhesive Srength | Iron 25℃ | MPa | 12 | ||||||
*Curing conditions : 25℃ - more than 24 hours
This product is made in Japan.
Please contact us for details.
According to some country and regional regulation regarding chemical substances, this product may not be exported.
Please contact us for details.
According to some country and regional regulation regarding chemical substances, this product may not be exported.
(5) How to use
・If there is any sedimentation of the contents, please stir thoroughly before use.
・Use a separate spatula to separate the main agent and hardener.
・If the mixing ratio is different, it may cause poor curing.
・If there is any dirt on the base material, it may cause poor adhesion, so please clean or degrease it beforehand.
1. Calculate the weight of main agent and hardener to mix, according to the mixing ratio designated in product information.
2. At first, weigh main agent in a plastic cup, then put hardener into the same cup.
3. Stir well main agent with hardener in the plastic cup. Please use a spatula. We recommend use a metal or plastic.
4. Stir well at the bottom and corner of the cup.
5. After stirring, defoam mixed resin if necessary.
6. Apply to the base material and paste together to cure. Be careful not to move the substrate during curing.
・If there is any sedimentation of the contents, please stir thoroughly before use.
・Use a separate spatula to separate the main agent and hardener.
・If the mixing ratio is different, it may cause poor curing.
・If there is any dirt on the base material, it may cause poor adhesion, so please clean or degrease it beforehand.
1. Calculate the weight of main agent and hardener to mix, according to the mixing ratio designated in product information.
2. At first, weigh main agent in a plastic cup, then put hardener into the same cup.
3. Stir well main agent with hardener in the plastic cup. Please use a spatula. We recommend use a metal or plastic.
4. Stir well at the bottom and corner of the cup.
5. After stirring, defoam mixed resin if necessary.
6. Apply to the base material and paste together to cure. Be careful not to move the substrate during curing.
Company Profile
PELNOX, LTD.
We are a formulator of resin compounds and adhesives manufacturing company, offering more than 900 products to more than 1,000 companies around the world.We can assist the customers where needed, from the small quantity prototype stage, up to the development of resin products. That is a wide range of materials including epoxy liquids and powders, urethane, silicone, and conductive paste materials.
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