DBC (Direct Bonded Copper) technique denotes a special process in which the copper foil is directly bonded onto the Al2O3 

ceramic substrates under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation, 

high thermal conductivity, fine solderability and high bonding strength. It may be structured just like PCB to get etched wiring and has high current loading capability. Therefore, DBC ceramic substrates have become the base materials for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for the "chip on board" technique which represents the packing trend in this century.

Key Features

    Fine Mechanical Strength

    Fine Adhesion and Corrosion Resistent

    Excellent Electrical Insulation and Thermal Conductive Properties

    High Reliability

    Lower Thermal Expansion Coefficient

    Etchable to Various Graphs

Applications

    Power Semiconductor Modules                                                Power Hybrids

    Power Control Circuits                                                              Solid-state Relays

    Semiconductor Refrigerators                                                    Electronic Devices for Automobile

    Intelligent Power Assemblies                                                    Solar Cell Board

Name: Herbert

Email: scdz7(at)china-rectifier.com

Phone Number/Whatsapp: +86-18920872209

Tel: +86-022-27474602

Fax: +86-022-27474400