HY500 series grey CPU silicone Thermal Grease compound can with 150g

Product Overview

Description

Product Description 

HY500 series grey CPU silicone Thermal paste compound 100g 150g in the can

                                  Best cost performance!!!

                      Ideal for the entry CPU and PCB LED heat sink

HY500 series are optimized for a wide range of bond lines between modern CPUs and high performance heat-sinks or air-cooling solutions.

 

Specifications

 

Items	HY510	HY520	HY530	HY550	Unit
Thermal conductivity	>1.93	>2.3	>2.5	>2.7	W/m-K
Thermal Impedance	<0.225	<0.214	<0.126	<0.105	0C-in2/W
Gravity	>2.4	>2.5	>2.63	>2.76	g/cm3
Viscosity	70	70	70	70	Pa.s
Thixotropic Index	380±10	350±10	320±10	300±10	1/10mm
Operation Temperature(Peak)	-30~280	-30~280	-30~280	-30~280	0C