CPU COOLER Syringe Thermal Paste Heatsink Compound for CPU Cooler 360 XBox repair

Product Overview

Description

Product Description 

 

High thermal conductivity thermal paste for cpu fan  (HY500 series)

 

                                 Best cost performance!!!

 

               Ideal for the entry CPU cooler and high power PCB LED

 

HY500 series are optimized for a wide range of bond lines between modern  CPUs and high performance heat-sinks or air-cooling solutions.

 

Specification

 

 

Items	HY510	HY520	HY530	HY550	Unit
Thermal conductivity	>1.93	>2.3	>2.5	>2.7	W/m-K
Thermal Impedance	<0.225	<0.214	<0.126	<0.105	°C-in2/W
Gravity	>2.4	>2.5	>2.63	>2.76	g/cm3
Viscosity	70	70	70	70	Pa s
Thixotropic Index	380±10	350±10	320±10	300±10	1/10mm
Operation Temperature(Peak)	-30~280	-30~280	-30~280	-30~280	°C