Твердые кислотные медные гальванические химикаты
Твердые кислотные медные гальванические химикаты
Твердые кислотные медные гальванические химикаты
Твердые кислотные медные гальванические химикаты

Твердые кислотные медные гальванические химикаты

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Product Overview

Description


Product Description

Hard Acid Copper Electroplating Chemicals

3 items: additive HN-601; brightener HN-602; make-up agent HN-603

Process Advantages

1) High hardness of deposit, hardness can reach 240HV
2) Stable hardness of deposit, it can maintain for six months without change.
3) Fine crystal on deposit, no pitting deposit.
4) This process is easy to control with stable bath in wide range of current density.
5) It can obtain smooth surface with good overall performance.
6) Suitable for gravure acid copper plating.

Detailed Images
Bath composition & Technical Data
Usage Range
Standard
Copper sulfate (CuSO4·5H2O)
Sulfuric acid (H2SO4)
Chloride ion (Cl - )
200 – 240 (g/L)
50 – 80 (g/L)
80 – 120 (mg/L)
220 (g/L)
65 (g/L)
100 (mg/L)
brightener HN-602
make-up agent HN-603
2 – 3 (mL/L)
4 – 6 (mL/L)
2 (mL/L)
4 (mL/L)
Temperature
Current density in cathode
Anode

Agitation
Filter
35 – 45 °C
20–30 (A/dm2)
Phosphorous copper (0.03-0.06phosphorous)
Air agitation
Continuous filter
43 °C
25 (A/dm2)
Phosphorous copper
(0.03-0.06%phosphorous)
Air agitation
Continuous filter
Packing & Delivery
Our Service

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