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LUX underfloor heating tile backer boards are well suited to underfloor and under tile heating applications. Offering excellent Thermal properties, high density and moisture proof. Installed below underfloor heating cables or mats on an existing un-insulated concrete or timber floor they will greatly reduce warmup time and subsequent running costs. LUX underfloor heating tile backer board is an advanced product which saves you money by preventing heat loss into concrete floors.
Underfloor Heating Tile Backer Boards are the perfect solution to insulate and waterproof in one operation. Ideal to use as an insulation board for most internal construction tasks. The board can be fixed to any suitable floor and installation can be a one man operation, as it is light to use and can be cut easily with a saw or knife. When fixed into place,the joints should be reinforced with a self-adhesive fibreglass mesh tape,tiling can then commence.
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Proceed to lay the mats and floor tiles in the standard way that is described in the supplier instructions for use heating mats and cables. It is not necessary to first penetrate the foundation boards, as LUX boards stick very well to the cement adhesive materials even without the penetration coat.
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Packing Details : Packing with paper carton and pallet
Delivery Details : 25-30 days after deposit
A: Underfloor heating tile backer Boards help prevent heat loss through concrete floors and is therefore ideal for use with underfloor heating systems. When using thermal boards in conjunction with underfloor heating, a warm floor can be achieved in as little time as 20 minutes, whereas it can take two hours or more on a completely uninsulated base.
A: When laying tiles onto floors, fitting a thermal insulation board between the floor base and the tiles will ensure the tiles are secured and permanently fixed to the floor,even in areas in contact with water.
A: Our board is a waterproof board constructed from a core of fire resistant XPS encased in a glass fibre mesh reinforced with polymer cement.
A: 1. Acts as a thermal barrier and significantly reduces heat loss to the substrate.
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