Electrical and Electromechanical Assembly Services

Product Overview

Description

Electrical and Electromechanical Assembly Services

 

- PCB board Size: 457x567cm(max);4x3cm(Min)

- IC Pitch(min):0.2mm

- Chip Size(min):0402 /1005(1.0x0.5mm)

- BGA Size:8x6mm~37x37mm

- BGA Pin Count: 48pin~600pin

- Package: SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA

- u-BGA Ball diameter: 0.2mm

Electrical and Electromechanical Assembly Services

1	Layer	1-22 layer
2	Material	FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,
3	Board thickness	0.2mm-3.5mm
4	Max panel size	630mm*520mm
5	Min.drilled hole size	0.5mm
6	Min.line width	0.075mm(3mil)
7	Min.line spaceing	0.075mm(3mil)
8	Surface finish/treatment	HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
9	Copper thickness	0.5oz Min.,5.0oz Max
10	Solder mask color	green/black/white/red/blue/yellow
11	Electronic Component	High precision 0201,0402,0603,fine pitch QFP,BGA
12	Inner packing	Vaccum packing,Plastic bag
13	Outer packing	standard carton paking
14	Hole tolerance	PTH:±0.076,NTPH:±0.05
15	Certificate	UL,ISO9001,ISO14001,ISO/TS16949,ROHS
16	Profiling punching	Routing,V-CUT,Beveling
17	Staff	Experienced technical staff
18	Products experience range	industrial, automotive, medical, computing, storage,instrumentation, traffic, industrial power, battery,fire alarm,CCTV, wireless communication,telecommunication, networking, printer and house controller